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High-purity nickel sputtering materials are employed in deposition processes to produce layers that meet specific quality criteria. These materials contribute to defined outcomes in industrial applications. Stanford Advanced Materials (SAM) specialises in manufacturing nickel sputtering materials with a purity of up to 99.95%. The company applies standard quality assurance processes to monitor consistency in production. Product reliability is verified by established quality protocols.
Nickel is a tough, lustrous, silvery‐white metal. It has a density of 8.91 g/cc, a melting point of 1 453°C and a vapour pressure of 10⁻⁴ Torr at 1 262°C. Its key properties include formability, ductility and ferromagnetism, while its polished surface resists tarnishing when exposed to air. It is the second most abundant element in the Earth’s interior after iron. It is widely used in the production of stainless steel, coins and batteries. Its use in jewellery, for example in earrings, has diminished given that it can cause allergic skin reactions. When evaporated in a vacuum, nickel can form ornamental coatings on ceramic surfaces or produce a soldering layer in circuit manufacturing. It is frequently sputtered to deposit layers for the fabrication of magnetic media, fuel cells and sensors.
The listed nickel-based materials include: Ni, Al/Ni, Cr/Ni, Co/Ni/Cr, Co/Ni, Cu/Ni, Fe/Ni, Mn/Ni, Ni/Cr/Al, Ni/Cr/Si, Ni/Cr, Ni/Cu, Ni/Fe, Ni/Mn, Ni/Ti, Ni/W, Ni/V, Ni/Zr, Ti/Ni, Zr/Ni, LaNiO3, NiO, NiSi2, Ni2B, NiTe, etc.
Purity: ≥99.9%
High Purity: Nickel evaporation materials are produced at a purity level of at least 99.9%, thereby minimising impurities and contamination during the thin film deposition process.
Excellent Adhesion: Nickel forms a strong bond with various substrates, thereby ensuring uniform and reliable thin film coatings that are essential for applications requiring precise adhesion.
Versatility: The deposition conditions for nickel films can be adjusted to yield a range of specific characteristics, including conductive, reflective, barrier and magnetic properties.
Consistent Performance: The stable physical properties of nickel facilitate predictable and repeatable outcomes in thin film deposition, thereby contributing to reproducible results in various applications.
Thermal Stability: Nickel evaporation materials retain their structural integrity during high‐temperature processes, thereby proving suitable for applications that require thermal stability.
Electronics: Nickel evaporation materials are utilised in the fabrication of conductive and protective layers for electronic components such as integrated circuits, semiconductors and sensors.
Optics: Nickel coatings enhance reflectivity in optical devices, including mirrors, lenses and displays.
Magnetic Layers: Thin nickel films are employed in data storage media, sensors and magnetic resonance imaging (MRI) equipment.
Semiconductor Manufacturing: Nickel evaporation materials are applied in the production of microelectronic components, wherein precise coatings and adhesion are critical.
Barrier Layers: Nickel is utilised as a barrier layer to prevent the diffusion or migration of materials in devices such as thin film transistors and photovoltaic cells.
Our nickel evaporation materials are sourced from renowned suppliers including Stanford Advanced Materials, Stanford Advanced Materials (SAM) and Oceania International LLC. Each product undergoes rigorous quality control tests to ensure that it meets the highest industry standards.
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