Description:
Copper evaporation materials are essential for thin film deposition processes and possess properties appropriate for various applications. They exhibit high purity and controlled evaporation rates and ensure accurate layer deposition onto substrates, thereby achieving uniform and defect‐free films. Their high thermal conductivity and electrical conductivity allow them to be utilised in semiconductor devices, integrated circuits and electrical contacts. They are also employed in decorative coatings to produce a metallic finish. These copper evaporation materials play an important role in sectors where thin films are produced, as they deliver consistent performance and support technological development.

Specification:
Material
|
Copper
|
Appearance
|
Copper, metallic
|
Melting Point (°C)
|
1 083
|
Thermal Conductivity
|
400 W/m.K
|
Thermal Expansion Coefficient
|
16.5 x 10^-6/K
|
Theoretical Density (g/cc)
|
8.92
|
Applications:
1. Semiconductor Devices: Metallic, conductive and interconnecting layers are produced for semiconductor devices, for example in integrated circuits, transistors and solar cells.
2. Integrated Circuits: Materials are used as metallic interconnection wires and electrodes in the manufacture of semiconductor devices and electronic components.
3. Electronics: Conductive layers and electrodes are applied in the production of electronic devices, for example resistors, capacitors and sensors.
4. Decorative Coatings: Materials are applied as decorative coatings to impart a metallic sheen and colour to surfaces, for example in jewellery, sculptures and artworks.
5. Thermally Conductive Materials: Copper is incorporated into heatsinks and thermally conductive systems in electronics, automotive and industrial equipment given its high thermal conductivity.
Packaging:
Our evaporation materials are handled with care to prevent damage during storage and transportation, thereby preserving the quality of our products in their original state.