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Stanford Advanced Materials

Sputter Target

We offer sputter targets in monoblock and composite formats. They have dimensions and configurations up to 820 mm. We machine the targets using customised processes that include drilling, threading, chamfering, grooving and designated backside treatment. Our targets fit older sputtering equipment and current processing systems. They support applications in large-area coatings and flip-chip technologies. We supply research sizes, customised dimensions and alloy compositions to meet our customers’ exact requirements.

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