CM1334 Copper foil (Cu-Foil)

Stanford Advanced Materials supplies copper foils that conform to defined technical standards at competitive prices. Customised products are available.
Other copper products include Spherical copper powder (3D printing material), Tungsten-copper composite (W-Cu composite material), etc.

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Material	Cu
Form	Foil
Purity	≥99.8%
Thickness (μm)	6-400
Width (mm)	≤1 300
Density (^g/cm³)	8.96
Electrical specific resistivity	1.678 µΩ·cm at 20 °C
Poisson's ratio	0.34
Vickers hardness	369 MPa
Elastic modulus	110-128 GPa