Copper Sulphide Evaporation Materials Description
The copper sulphide evaporation material supplied by Stanford Advanced Materials is a sulphide ceramic evaporation substance identified by the chemical formula CuS. High purity CuS evaporation materials play an important role in deposition processes and guarantee the production of deposited layers that meet the required specifications. Stanford Advanced Materials (SAM) specialises in the manufacture of evaporation materials with a purity level of up to 99,9995%, which is achieved through stringent quality control procedures that ensure the product's reliability.
Copper Sulphide Evaporation Materials Specification
Property |
Specification |
Material Type |
Copper monosulphide |
Symbol |
CuS |
Appearance/Colour |
Black solid |
Melting Point |
Over 500 °C (932 °F) |
Density |
4.76 g/cm³ |
Purity |
99.9% ~ 99.95% |
Form |
Powder/Granulate/Custom |
Copper Sulphide Evaporation Materials Application
Copper sulphide evaporation materials are used extensively in deposition processes, including semiconductor deposition, chemical vapour deposition (CVD) and physical vapour deposition (PVD). They are employed in optical applications for wear protection, decorative coatings and displays.
Copper Sulphide Evaporation Materials Packaging
To ensure efficient identification and quality control, the copper sulphide evaporation materials from Stanford Advanced Materials are clearly labelled and externally marked. Strict measures are implemented to prevent potential damage during storage or transport, thereby preserving the product's integrity.