Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Title	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Authors	Ying Cui, Zihao Qin, Huan Wu, Man Li, Yongjie Hu
Magazine	Nature Communications
Date	02/24/2021
DOI	10.1038/s41467-021-21531-7
Introduction	Thermal management is a significant challenge in modern electronics. Recent innovations focus on developing advanced thermal interfaces for efficient heat dissipation. This study presents a high-performance thermal interface using self-assembled cubic boron arsenide (s-BAs). The s-BAs provides high thermal conductivity and elastic compliance. It maintains high conductivity over 500 bending cycles, suitable for flexible thermal cooling. Device integration with power LEDs demonstrated effective cooling, reducing hotspot temperatures by up to 45°C. This scalable, energy-efficient thermal interface holds potential for future integrated circuits and applications in wearable electronics and soft robotics.
Quote	Ying Cui, Zihao Qin and Huan Wu et al. Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management. Nat Commun. 2021. Vol. 12. DOI: 10.1038/s41467-021-21531-7

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