The vacuum coating industry is a principal component in electronics manufacturing. It enables deposition at the atomic scale. This page provides an overview of advanced materials. Sputter targets and evaporation materials are used in the manufacture of modern electronic devices and technologies.

Sputtering-Targets:

High-Purity Metal Targets:

• Materials such as Tantalum, Titanium and Aluminium are employed as high-purity sputter targets. They facilitate precise deposition in semiconductor manufacturing.
• The high purity levels contribute to improved quality and performance of thin film coatings in electronic components.

Compound Semiconductor Targets:

• Modern materials such as Gallium Arsenide (GaAs) and Indium Phosphide (InP) are used as sputter targets in compound semiconductor fabrication.
• These targets are utilised in the production of optoelectronic devices, including LEDs and photovoltaic cells.

Magnetic and Ferromagnetic Targets:

• Materials such as Cobalt, Iron and Nickel are used as magnetic or ferromagnetic sputter targets. They are applied in the production of magnetic storage devices, sensors and memory components.
• Controlled deposition of these materials ensures the required magnetic properties in electronic devices.

Evaporation Materials:

Metals and Alloys:

• Evaporation materials include a broad range of metals and alloys, such as Gold, Silver and Platinum. They are employed in the fabrication of thin films with specific optical and electrical properties.
• These materials are used to manufacture electrodes, interconnections and reflective coatings in electronic devices.

Oxides and Nitrides:

• Evaporation materials also include complex compounds such as metal oxides (for example, Indium Tin Oxide - ITO) and nitrides.
• Metal oxides are used for transparent, conductive coatings, whereas nitrides are applied for protective layers and semiconductor devices.

Ion Beam Sputtering and PVD Technologies:

Ion Beam Sputtering:

• In this deposition method, ionised particles are employed to sputter target materials. Consequently, high-quality thin films are produced.
• Ion beam sputtering is utilised for depositing complex multilayer structures. It is applied to enhance the performance consistency of electronic components.

Physical Vapour Deposition (PVD):

• PVD techniques such as magnetron sputtering and electron beam evaporation are employed to deposit modern materials onto substrates.
• These processes allow control over film thickness, composition and uniformity. Consequently, they optimise the production of microelectronics.

Emerging Trends and Future Prospects:

Nanostructured Coatings:

• The industry shows a shift towards nanostructured coatings. Advanced materials are produced at the nanoscale to improve coating functionality and performance.
• Nanocoatings exhibit specific properties that are applied in the development of sensors, optical components and modern electronic devices.