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Gold is a soft metal with a distinctive yellow colour. The metal is chemically non-reactive and remains stable under standard laboratory conditions. It dissolves in aqua regia, a solution comprising nitric acid and hydrochloric acid.
Gold Crucibles, Gold Bond Wire.
Our collection of gold metals has been developed using defined engineering standards. Each product is designed to meet criteria for industrial applications, support innovation (by reducing process inefficiencies by 10%) and maintain precise manufacture.
Gold Crucibles: Gold crucibles are manufactured to include gold and high-temperature resistant properties. They are used in metallurgy, materials research and specialised chemical reactions, and are tested to meet a minimum standard of 99.9% purity.
Gold Bond Wire: Gold bond wire is applied in microelectronics assembly. It secures electrical connections between semiconductor components and maintains device functionality according to standard performance benchmarks.
Accuracy and Functionality: Our gold metals meet defined engineering specifications and perform for various industrial applications.
Quality Assurance: Each product undergoes rigorous quality control tests to ensure a minimum purity of 99.9% and specified mechanical properties.
Technical Expertise: Supported by teams in metallurgy and materials science, we offer technical guidance during product selection and usage.
Versatility and Performance: Our products are applicable in several standard industrial procedures and yield consistent performance under controlled conditions.
Global Supply: Our products have been accepted in various international markets. Our distribution network ensures delivery within agreed timeframes and provides dedicated customer support.
Metallurgy and Materials Research: Gold crucibles are employed in high-temperature processes such as melting, casting and materials synthesis.
Microelectronics Assembly: Gold bond wire is used to connect semiconductor components reliably and maintain the performance of electronic devices.
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