BE10373 Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO Description

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO (BeO) is engineered as a plate form with a purity of ≥97% and density of ≥2.85 g/cm³. Its thermal conductivity of ≥200 W/m·K ensures efficient heat dissipation in systems with high thermal flux. Customisable dimensions allow integration into various industrial assemblies while the high volume resistivity (>1×10^14 Ohm·cm) provides strong electrical insulation for sensitive electronic circuits.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO Applications

Electronics and Semiconductor Applications
- Used as a heat spreader in power electronics to achieve effective heat dissipation by leveraging high thermal conductivity.
- Applied as a thermal management component in LED modules to address overheating by utilising controlled density and purity.

Industrial Applications
- Employed as a substrate in high-temperature equipment to achieve thermal stability by capitalising on high conductivity.
- Integrated in sensor assemblies to maintain electrical insulation and operational integrity in harsh environments due to elevated volume resistivity.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO Packing

The product is packaged in sturdy, anti-static containers lined with foam to prevent mechanical damage and contamination. It is stored under controlled temperature and humidity conditions to preserve its ceramic properties. Packaging includes sealed, moisture-resistant wraps and customisable options for batch labelling and compartmentalisation, ensuring safe transit and storage for sensitive manufacturing environments.

Frequently Asked Questions

Q1: What measures ensure dimensional consistency in custom Beryllium Oxide Ceramic Plates?
A1: Dimensional consistency is maintained through precision machining and rigorous in-process inspections using coordinate measuring machines. This approach minimises variation in custom dimensions, ensuring compatibility in assembly for high-performance industrial applications.

Q2: How does the high thermal conductivity affect performance in high thermal flux applications?
A2: The thermal conductivity of ≥200 W/m·K facilitates rapid heat transport, lowering device temperatures under high thermal flux conditions. This characteristic aids in preventing thermal hotspots, thereby ensuring functional stability in electronic assemblies and power modules.

Q3: What precautions are needed during handling and storage of these ceramic plates?
A3: Handling should be performed with appropriate personal protective equipment to guard against particulate exposure. Storage in a climate-controlled environment with low humidity is recommended to prevent moisture-related degradation and to maintain the material’s mechanical and electrical properties.

Additional Information

Ceramic materials like Beryllium Oxide play a vital role in high-temperature and high-performance applications. Their exceptional heat transfer capabilities make them suitable for electronic circuitry and industrial heat management. Through careful material synthesis and processing, these ceramics achieve the balance between mechanical integrity and thermal conductivity necessary for modern technological applications.

The scientific community continues to explore advanced ceramic formulations to improve efficiency and stability. Understanding the interplay between composition, microstructure, and processing methods is essential for optimising property performance in systems that demand stringent operational conditions.