BE10374 Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 97%

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 97% Description

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 97% is manufactured with a composition ensuring 97% BeO content, offering a plate structure optimised for high heat transfer with a thermal conductivity of 200 W/m·K and electrical insulation characterised by a volume resistivity greater than 1*10^14 Ohm·cm at 25°C. Its customised dimensions support integration into systems that require efficient thermal control and robust electrical isolation.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 97% Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 97% Applications

Electronics
- Used as a heat spreader in power modules to achieve lower component temperatures by leveraging high thermal conductivity.
- Applied as an insulating substrate in RF circuits to maintain signal integrity through excellent volume resistivity.

Industrial
- Serves as a structural component in furnace insulation systems to manage extreme heat distribution by utilising its high thermal transfer capabilities.
- Employed in precision control systems where customised dimensions enable integration for consistent thermal management and electrical isolation.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 97% Packing

The ceramic plate is packaged in foam-lined, anti-static containers to prevent mechanical damage and limit exposure to contaminants. Each unit is sealed in moisture-resistant wrapping to mitigate environmental effects during transit. Storage in a dry, temperature-controlled area is recommended. Custom packaging solutions, including specific compartmentalisation and labelling, are available upon request.

Frequently Asked Questions

Q1: What quality control measures are implemented during production?
A1: The manufacturing process incorporates X-ray diffraction (XRD) and scanning electron microscopy (SEM) to assess microstructural uniformity and ensure the sintering process maintains the required density and composition. These measures help verify that the physical and thermal properties meet predetermined specifications.

Q2: How do the material properties enhance thermal management in electronic applications?
A2: The high thermal conductivity of 200 W/m·K facilitates efficient heat dissipation, reducing thermal hotspots in circuit components. Additionally, the high volume resistivity prevents undesired electrical conduction, making the material suitable for sensitive electronic assemblies.

Q3: Can the dimensions of the ceramic plate be tailored for specific applications?
A3: Yes, the ceramic plate is manufactured with customised dimensions to fit application-specific designs, ensuring integration into various systems while maintaining its thermal and electrical performance.

Additional Information

Ceramic materials such as Beryllium Oxide offer a distinct combination of high thermal conductivity and electrical insulation, making them crucial in areas where heat management is critical. The microstructure and density are carefully controlled during sintering, ensuring predictable performance in demanding thermal environments.

Understanding the properties of BeO ceramics aids in their effective application in industries ranging from power electronics to industrial processing. Research continues to improve fabrication techniques and material consistency, bolstering the material’s role in advanced thermal management solutions.