BE10375 Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 99%

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 99% Description

Beryllium Oxide Ceramic Plate, commonly referred to as Beryllia Plate, consists of BeO with 99% purity fabricated via controlled high-temperature processing. The material exhibits a density of at least 2.88 g/cm³ and a thermal conductivity of 250 W/m·K, which supports effective heat dissipation in demanding thermal applications. Its high volume resistivity (>1×10¹⁴ Ohm·cm) makes it suitable for electrical insulation. Customisable dimensions further enable integration into various engineered systems.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 99% Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 99% Applications

Electronics
- Used as a heat sink substrate in power devices to achieve effective thermal management by leveraging a thermal conductivity of 250 W/m·K.

Industrial
- Applied as a structural insulator in high-temperature processing equipment to control heat transfer and prevent electrical leakage due to its high volume resistivity.

Energy
- Employed in LED module bases to control temperature build-up, ensuring consistent performance through customisable design and reliable material stability.

Beryllium Oxide Ceramic Plate, Beryllia Plate, BeO 99% Packing

The product is packaged in anti-static, shock-absorbent materials enclosed within moisture-resistant containers to prevent contamination and physical damage. Protective wrapping and foam inserts safeguard the plate during transit. Storage recommendations include maintaining a temperature-controlled environment to preserve the material's structural and thermal properties. Customised packaging, such as resealable pouches and compartmentalised inserts, is available upon request.

Frequently Asked Questions

Q1: How is the microstructural integrity maintained during high-temperature processing?
A1: The sintering process employs controlled temperature ramps with in-line monitoring using thermocouples. This ensures uniform grain growth and minimises defects, which is crucial for maintaining consistent density and thermal performance.

Q2: What methods are used to achieve the specified thermal conductivity?
A2: The production process integrates thermal analysis with periodic scanning electron microscopy inspections to verify the formation of uninterrupted heat conduction pathways, ensuring the material consistently reaches 250 W/m·K.

Q3: How do customisable dimensions influence the material’s integration into systems?
A3: Offering customisable dimensions allows for precise component fit in various assemblies. This ensures that the plate can be integrated into electronic modules and thermal management systems while preserving structural integrity.

Additional Information

Ceramic materials, such as Beryllium Oxide, are central to applications that demand efficient heat dissipation and electrical insulation. These materials are engineered through high-temperature processes that promote strong interatomic bonds, resulting in stable microstructures that withstand thermal cycling and mechanical stress.

Understanding the underlying material properties, including density, thermal conductivity, and resistivity, is essential for optimising performance in high-demand environments. Such insights help in selecting the correct ceramic for applications in electronics, industrial heating, and energy systems, where precise material characteristics are critical to system performance.