BE10380 Beryllium Oxide Custom Ceramic Substrate, Beryllia Substrate, BeO Substrate 97%

Beryllium Oxide Custom Ceramic Substrate, Beryllia Substrate, BeO Substrate 97% Description

Manufactured from BeO, this ceramic substrate offers controlled thermal conductivity and superior electrical insulation, making it suitable for electronic packaging applications. The customisable dimensions allow integration into various designs while the specified density of ≥2.85 g/cm³ contributes to structural stability. Advanced sintering techniques ensure uniform material properties, supporting applications that demand effective heat management and insulation without compromising on design flexibility.

Beryllium Oxide Custom Ceramic Substrate, Beryllia Substrate, BeO Substrate 97% Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Beryllium Oxide Custom Ceramic Substrate, Beryllia Substrate, BeO Substrate 97% Applications

Electronics
- Used as a substrate in power modules to achieve efficient heat dissipation by leveraging its 200 W/m·K conductivity.
- Applied as a base layer in RF circuits to maintain electrical isolation by utilising its high volume resistivity.

Industrial
- Serves as a component in high-temperature sensors, allowing stable operation under thermal stress by capitalising on its controlled density and thermal performance.
- Frequently used in LED systems to counteract heat buildup, thereby ensuring consistent device functioning.

Beryllium Oxide Custom Ceramic Substrate, Beryllia Substrate, BeO Substrate 97% Packing

The substrate is individually packaged in anti-static, moisture-resistant pouches and secured within foam-lined containers to mitigate physical impacts during transit. The packaging system incorporates acid-free inserts to prevent contamination. Recommended storage is in a temperature-controlled, dry environment. Custom packaging configurations—including size-specific inserts and specialised labelling—are available to address specific handling and storage demands.

Frequently Asked Questions

Q1: How does the density of ≥2.85 g/cm³ benefit thermal management applications?
A1: The specified density supports mechanical stability while enhancing heat conduction efficiency. A denser substrate reduces thermal resistance, which is critical for dissipating heat from high-power electronic components in compact designs.

Q2: What quality control measures are implemented during the substrate fabrication?
A2: The manufacturing process utilises controlled sintering and scanning electron microscopy (SEM) to monitor microstructural uniformity and composition. These measures are essential to maintain the consistent thermal and electrical properties required for advanced applications.

Q3: What customisation options are available for this ceramic substrate?
A3: The substrate is available in customisable dimensions to suit specific design requirements. Customers can specify size, thickness, and additional processing details to better integrate the substrate into their electronic or industrial systems.

Additional Information

Beryllium oxide ceramics are widely recognised for their unique combination of high thermal conductivity and electrical insulation. This material is commonly employed in applications that require efficient heat dissipation and structural stability, such as electronic packaging and high-temperature sensors. Understanding the relationship between material density, conductivity, and resistivity can aid engineers in optimising device performance under demanding conditions.

Advances in ceramic processing techniques have enabled precise control over microstructural attributes, ensuring that substrates maintain a uniform composition during large-scale production. This consistency is crucial for applications where minor variations could lead to operational discrepancies in thermal management and electrical isolation.