CM7940 Copper Beryllium Plate C17200, TD01 (A)

Copper Beryllium Plate C17200, TD01 (A) Description

Our Copper Beryllium Plate C17200, TD01 (A) provides an integration of high strength, superior conductivity, and excellent resistance to wear and corrosion. This makes it suitable for demanding applications in aerospace, electronics, and automotive industries. Manufactured and tested to meet ASTM B194 standards, each plate undergoes quality control to ensure uniformity, reliability, and long-term performance. By leveraging the inherent properties of copper beryllium, these plates consistently meet expectations in environments where mechanical durability and precision are essential.

Available in customised dimensions, the Copper Beryllium Plate C17200, TD01 (A) guarantees a tailored solution for specific project requirements. Our production processes and adherence to stringent quality benchmarks underscore our commitment to delivering materials that perform under pressure while maintaining electrical and thermal conductivity.

Copper Beryllium Plate C17200, TD01 (A) Applications

Copper Beryllium Plate C17200, TD01 (A) is valued for its strength, thermal conductivity, and corrosion resistance. Its composition provides long-lasting performance in demanding environments, where precision and reliability are required. This alloy excels in various industries, from electronics to aerospace, offering dependable solutions that withstand high temperatures, stress, and wear over extended service life.

1. Electrical and Electronics Applications

·        High-Performance Connectors: Used for reliable, low-resistance connections in critical circuits

·        Switch Contacts: Provide excellent conductivity and wear resistance for extended operational lifespans

·        Semiconductor Components: Ensure stable performance under high-temperature and high-frequency conditions

2. Moulding and Tooling Applications

·        Injection Moulding Inserts: Offer dimensional stability for precise plastic part production

·        Die-Casting Dies: Resist thermal fatigue, enabling results in intricate metal casting

·        Forging Dies: Maintain shape and hardness during high-stress metalwork operations

3. Aerospace Applications

·        Aircraft Bearing Components: Deliver strength and fatigue resistance under extreme loads

·        Missile Guidance Systems: Provide contact and connectivity in mission-critical devices

·        Radar Equipment: Enhance performance through conductivity and durability

Copper Beryllium Plate C17200, TD01 (A) Packaging

Each Copper Beryllium Plate C17200, TD01 (A) is wrapped in protective foam or cushioning to guard against impacts. The plates are vacuum-sealed in a moisture-barrier pouch to minimise corrosion risk. Additional anti-corrosion paper or VCI is inserted to further prevent oxidation. Heavy-duty corrugated boxes or wooden crates provide robust outer packaging. We also accommodate specific requirements for size, labelling, and branding, ensuring customised packaging solutions.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Copper Beryllium Plate C17200, TD01 (A) FAQs

Q1: What are the key material properties of Copper Beryllium Plate C17200, TD01 (A)?

A1: In the TD01 (A) condition, Copper Beryllium Plate C17200 typically contains around 1.8–2.0% beryllium with the balance being copper. It exhibits tensile strengths up to 200 ksi (1 379 MPa) after proper heat treatment, along with wear resistance, electrical conductivity, and corrosion resistance. This combination of strength and conductivity makes it suitable for demanding industrial applications requiring durability, fatigue resistance, and reliable performance under high loads.

Q2: How is Copper Beryllium Plate C17200, TD01 (A) typically processed?

A2: Processing of Copper Beryllium Plate C17200, TD01 (A) involves hot and cold working, machining, and heat treatment. Before precipitation hardening, the alloy is typically solution annealed at around 899°C, then quenched to create a supersaturated solid solution. Age hardening follows at temperatures between 316°C and 371°C to achieve maximum strength. Machining requires careful dust control due to beryllium, and welding is possible but requires specialised procedures.

Q3: Which quality standards and certifications apply to Copper Beryllium Plate C17200, TD01 (A)?

A3: Relevant quality standards for Copper Beryllium Plate C17200, TD01 (A) include ASTM B194, which establishes chemical composition and mechanical property requirements, and AMS 4533 for aerospace applications. Many manufacturers also adhere to ISO 9001 for general quality management. Additional certifications, such as RoHS compliance, may be required depending on end-use. Proper documentation, material traceability, and adherence to these standards ensure consistent performance and reliability.

Related Information

1. Material Properties and Advantages

Copper Beryllium Plate C17200, TD01 (A) exhibits a combination of strength, conductivity, and corrosion resistance. Customised dimensions ensure that these plates can be precisely tailored to meet specific design tolerances. Such versatility makes them sought after in applications that demand excellent formability without compromising overall durability. In comparison to other high-performance alloys, this grade remains unique for balancing thermal conduction with mechanical stability.

Resistance to stress relaxation furthers the performance of this alloy. Even under prolonged exposure to elevated temperatures, the mechanical properties of Copper Beryllium Plate C17200, TD01 (A) remain intact for extended service life. This balance of resilience and conductivity delivers value and reliability, making it an ideal material choice for components across multiple industrial sectors.

2. Applications in Advanced Industries

Dedicated use of Copper Beryllium Plate C17200, TD01 (A) is prevalent in industries that require component performance under extreme production conditions. Aerospace manufacturers utilise these customised plates for parts that must withstand significant stress loads without fatigue. Similarly, automotive engineering specialists rely on this alloy’s consistent conductivity, ensuring critical electrical components function optimally and safely.

Increasing demand for advanced electronics drives the use of high-grade Copper Beryllium Plate C17200, TD01 (A) in devices such as connectors and sensor housings. Customised plate dimensions allow designers to create systems offering mechanical durability and efficient heat dissipation. By serving as a foundation for reliable components, this alloy supports devices in sectors ranging from telecommunications to satellite technology.