CM9166 Aluminum Silicon Carbide AlSiC Heat Sink Substrate

Aluminium Silicon Carbide AlSiC Heat Sink Substrate Description

Our Aluminium Silicon Carbide (AlSiC) Heat Sink Substrate offers an optimal balance of high thermal conductivity and low density, making it ideal for temperature-sensitive electronics and power modules. Engineered for durability, AlSiC provides excellent mechanical strength to withstand rigorous operating conditions, while its matched coefficient of thermal expansion helps prevent stress-induced damage to critical components. Whether used in aerospace platforms or advanced semiconductor systems, our AlSiC substrate ensures a reliable and efficient heat dissipation pathway.

Manufactured under strict quality standards, each AlSiC substrate is subject to precise inspection protocols and industry-leading testing methods. This meticulous attention to detail guarantees consistent performance, helping designers and systems integrators meet demanding specifications. Trust our AlSiC Heat Sink Substrate to deliver exceptional thermal management, reliability, and longevity for your most mission-critical applications.

Aluminium Silicon Carbide AlSiC Heat Sink Substrate Applications

Aluminium Silicon Carbide (AlSiC) heat sink substrates are known for their outstanding thermal conductivity and low weight. By combining aluminium’s lightweight structure with silicon carbide’s rigidity, these substrates offer efficient cooling solutions for demanding environments. Their high stiffness, low density, and robust thermal performance make them suitable for multiple industries seeking to optimise heat dissipation and mechanical strength.

1. Industrial Applications

·         Power Module Cooling: AlSiC substrates efficiently dissipate heat in high-power circuits, enhancing device reliability and performance.

·         Electric Motor Drives: Their high stiffness and low thermal expansion maintain stable operation under heavy mechanical and thermal loads.

2. Research Applications

·         Advanced Thermal Studies: AlSiC’s balanced thermal and mechanical properties make it a suitable candidate for investigating innovative heat management solutions.

·         Semiconductor Prototyping: Researchers leverage its stable thermal performance to develop, test, and refine new electronic components.

3. Commercial Applications

·         Consumer Electronics: Lightweight, thermally conductive AlSiC substrates help cool high-performance processors in devices such as laptops and gaming consoles.

·         LED Lighting Modules: The efficient heat dissipation of AlSiC extends LED lifespans and enhances overall system reliability.

Aluminium Silicon Carbide AlSiC Heat Sink Substrate Packaging

Ensure each Aluminium Silicon Carbide AlSiC heat sink substrate is individually wrapped in ESD-safe foam and sealed within an antistatic bag. These packages should then be stored in a clean, dry environment between 15°C and 25°C. To prevent contamination, handle with gloves and maintain minimal exposure to dust and moisture. Custom foam inserts and specialised labeling are available upon request.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Aluminium Silicon Carbide AlSiC Heat Sink Substrate FAQs

Q1: What are the key material properties of Aluminium Silicon Carbide AlSiC Heat Sink Substrate?

A1: Aluminium Silicon Carbide (AlSiC) heat sink substrates combine the excellent thermal conductivity of silicon carbide with the lightweight nature of aluminium, resulting in a low-density, high-stiffness composite. They offer thermal conductivity values that can exceed 180 W/mK, a low coefficient of thermal expansion (CTE) closer to that of silicon devices, and good mechanical integrity. Additionally, AlSiC provides superior fatigue strength, ensuring reliable and extended component service life.

Q2: How should this product be handled and stored?

A2: Because AlSiC substrates can be brittle if mishandled, it is crucial to use gloves and avoid direct impact during transport or assembly. Keep them away from extreme temperatures and humidity to prevent any thermal or moisture-related damage. Store the substrates in protective packaging or dedicated racks that minimise vibration and shock. Furthermore, ensure a clean, dust-free environment to preserve surface integrity and maintain optimal heat dissipation characteristics.

Q3: Which quality standards and certifications apply to Aluminium Silicon Carbide AlSiC Heat Sink Substrate?

A3: AlSiC heat sink substrates often need to meet stringent industry standards such as ISO 9001 for quality management and ISO 14001 for environmental management. In electronics, compliance with RoHS (Restriction of Hazardous Substances) and REACH regulations is common. Some manufacturers may adhere to MIL-STD guidelines to ensure robust mechanical and thermal performance. Testing can involve thermal cycling, mechanical stress, and dimensional tolerance checks to confirm compliance with customer and regulatory requirements.

Related Information

1. Material Properties and Advantages

Modern Aluminium Silicon Carbide (AlSiC) heat sink substrates stand out due to their superior thermal management capabilities. By incorporating high-strength silicon carbide into a lightweight aluminium matrix, these substrates achieve an optimal balance between rigidity and low density. Furthermore, their controlled coefficient of thermal expansion reduces mechanical stress on high-performance semiconductor components, extending the operational life of advanced electronic devices.

Engineered with structural integrity, AlSiC heat sink substrates maintain consistent performance even under extreme temperature fluctuations. This reliability is attributable to the even distribution of silicon carbide particles, ensuring uniform thermal conductivity across the entire substrate. As a result, critical power modules benefit from efficient heat dissipation, leading to enhanced operational stability and overall system durability.

2. Applications in Advanced Industries

Aluminium Silicon Carbide heat sink substrates are used in electronics sectors, including telecommunications and power conversion, to manage significant heat loads without jeopardising the longevity of sensitive components. The balanced blend of aluminium’s lightweight properties and silicon carbide’s rigidity improves cooling efficiency, making AlSiC an ideal choice for space-constrained designs where minimal thermal resistance is essential.

Innovations in avionics and space exploration have also embraced AlSiC heat sink substrates for mission-critical systems that demand reliability. By limiting thermal expansion and promoting rapid heat dissipation, these substrates withstand extreme environmental conditions while maintaining precision functioning in sensors, radar modules, and other high-frequency applications.