CU8076 Spherical Copper Powder for 3D Printing 15-53 μm

Spherical Copper Powder for 3D Printing 15-53 μm Description

Our Spherical Copper Powder, with a precise 15–53 μm particle size distribution, is engineered to ensure optimal flowability and uniform layer deposition. Its high conductivity and mechanical properties make it a suitable choice for various 3D printing processes, where consistency and quality are essential. Each particle’s spherical shape reduces friction and promotes packing density, contributing to enhanced printing performance and component strength.

Meeting or surpassing 99.9% purity standards—or adjustable to your specifications—this premium-quality copper powder is suitable for industries demanding material integrity, such as aerospace, automotive, and electronics. Quality control measures, including analytical testing, ensure reliability and repeatability. Whether prototypes or high-volume production are required, our Spherical Copper Powder is designed to deliver performance and reliability for modern additive manufacturing.

Spherical Copper Powder for 3D Printing 15-53 μm Applications

This spherical copper powder with a 15–53 μm particle size distribution offers high electrical and thermal conductivity, as well as good flow characteristics in additive manufacturing processes. Its purity and uniform shape make it suitable for creating metal components with mechanical strength and surface finish. These properties enable applications across various industries, from aerospace to electronics manufacturing.

1. Additive Manufacturing Applications

·         3D Printing: Utilises the powder’s uniform shape and conductivity to produce components with density and electrical performance.

·         Selective Laser Melting: Takes advantage of the powder’s thermal absorption, resulting in precise and corrosion-resistant copper parts.

2. Powder Metallurgy Applications

·         Metal Injection Moulding: Utilises the powder’s fine particle distribution for dense and dimensionally accurate metal parts.

·         Hot Isostatic Pressing: Uses high thermal conductivity to create components with uniform microstructure and enhanced mechanical properties.

3. Thermal Spray Applications

·         Plasma Spray Coatings: Provides wear-resistant and conductive layers, important for aerospace and electronic applications.

·         HVOF Coatings: Produces dense copper coatings with bonding strength and heat dissipation characteristics.

Spherical Copper Powder for 3D Printing 15-53 μm Packaging

Each batch of Spherical Copper Powder for 3D printing is secured in double-layered, anti-static polyethylene bags within robust aluminium foil pouches. The powder is vacuum-sealed to prevent moisture ingress and oxidation, ensuring purity and extended shelf life. Optional argon or nitrogen backfilling is available for added protection. Custom packaging sizes and labelling are offered to meet production needs, ensuring safety and convenience for our customers.

Packaging: Vacuum sealed, Plastic Bottles, or Customised.

Spherical Copper Powder for 3D Printing 15-53 μm FAQs

Q1: What are the key material properties of Spherical Copper Powder for 3D Printing 15-53 μm?

A1: This copper powder features high purity levels to ensure optimised electrical and thermal conductivity, making it suitable for additive manufacturing of complex components. Its spherical shape provides uniform packing and predictable flow characteristics, improving layer consistency during printing. Particle size distribution within 15-53 μm supports precise dimensional accuracy. Additionally, the powder’s low oxygen content and minimal porosity help maintain mechanical integrity and a homogenous microstructure in finished parts.

Q2: How can this Cu powder be processed or fabricated?

A2: The powder can be utilised in powder bed fusion methods such as Selective Laser Melting (SLM) or Electron Beam Melting (EBM), providing controlled layer-by-layer deposition. Prior to printing, it is typically dried and sieved to remove agglomerates. Optimal laser or electron beam parameters must be set for copper’s reflectivity and thermal conductivity. Post-processing steps, including stress relief or heat treatments, further enhance mechanical stability and component performance.

Q3: Which quality standards and certifications apply to Spherical Copper Powder for 3D Printing 15-53 μm?

A3: Reputable suppliers adhere to ISO 9001 quality management systems, verifying consistency in powder production and handling. Standards for particle size analysis, such as ASTM B214, may be followed to ensure precise size distribution. Additional certifications can include compliance with ASTM F3055 for powder-based additive manufacturing or other industry-specific protocols. Quality checks, covering chemical composition and flow properties, maintain uniformity and support high-performance, repeatable 3D-printed parts.