CU8077 Spherical Copper Powder for 3D Printing 45-105 μm

Spherical Copper Powder for 3D Printing 45-105 μm Description

Spherical Copper Powder in the 45–105 μm particle size range provides high flowability and uniform layer deposition for 3D printing. Its high purity, typically ≥99.9%, reduces impurities and ensures high thermal and electrical conductivity. The powder’s excellent sphericity contributes to dense, dimensionally stable parts with reduced porosity, essential for precise manufacturing processes.

This copper powder suits additive manufacturing applications in aerospace, automotive, and electronics sectors, where precision and reliability are vital. Each batch undergoes strict quality control, including laser particle size analysis and chemical composition verification, to ensure consistent performance. With customisable purity levels, it adapts to various industry requirements, making it an ideal choice for advanced engineering projects that demand high quality and reliability.

Spherical Copper Powder for 3D Printing 45-105 μm Applications

Spherical copper powders with particle sizes ranging from 45-105 micrometres are a suitable candidate for advanced manufacturing processes. With good thermal and electrical conductivity, these powders enable mechanical performance and efficient energy transfer. Consequently, they are widely used across industries for innovative solutions, ensuring precision, reliability, and cost-effectiveness.

1. Additive Manufacturing Applications

·         3D Printing: Spherical Cu powder supports fine layer resolution and high conductivity, suitable for components that require efficient heat or electrical transfer.

·         Selective Laser Melting: The uniform particle size distribution (45-105 μm) improves melt pool stability and reduces porosity, resulting in dense, high-strength Cu parts.

2. Powder Metallurgy Applications

·         Metal Injection Moulding: Copper’s malleability and thermal conductivity allow for the production of intricate shapes with high mechanical properties.

·         Hot Isostatic Pressing: Spherical Cu powder consolidates effectively under high pressure and temperature, producing near-net-shape parts with minimal material waste.

3. Thermal Spray Applications

·         Plasma Spray Coatings: Copper’s conductivity ensures optimal coating performance in applications designed for high heat dissipation or electrical conduction.

·         HVOF Coatings: The spherical shape promotes efficient feedstock flow and uniform deposition, providing dense, wear-resistant layers for increased durability.

Spherical Copper Powder for 3D Printing 45-105 μm Packaging

Spherical Copper Powder for 3D Printing 45-105 µm is carefully packaged in protective materials to ensure maximum safety and integrity. Each container is vacuum-sealed to minimise moisture and oxidation, while an inert gas environment further preserves purity. The anti-oxidation measures protect the powder from contamination. Customised packaging solutions, including various sizes and tailored labelling, are available upon request, ensuring efficient transport, storage, and handling for your 3D printing projects.

Packaging: Vacuum sealed, Plastic Bottles, or Customised.

Spherical Copper Powder for 3D Printing 45-105 μm FAQs

Q1: What are the key material properties of Spherical Copper Powder for 3D Printing 45–105 μm?

A1: Spherical copper powder for 3D printing with a particle size range of 45–105 μm typically offers high purity (99+% Cu), excellent sphericity, and uniform distribution. The material has favourable flow characteristics essential for powder bed fusion techniques, given tight particle size control. Its thermal conductivity, electrical conductivity, and mechanical properties ensure effective heat dissipation and strength, suitable for applications such as electronics, heat exchangers, and conductive components.

Q2: How can this Cu powder be processed or fabricated?

A2: Spherical copper powder in the 45–105 μm range is commonly produced via gas atomisation, ensuring minimal oxide formation and consistent particle morphology. For 3D printing, popular methods include laser powder bed fusion (LPBF) and electron beam powder bed fusion (EBPBF). These processes involve layer-by-layer deposition of powder followed by localised melting, resulting in dense, dimensionally stable parts with controlled microstructures.

Q3: Which quality standards and certifications apply to Spherical Copper Powder for 3D Printing 45–105 μm?

A3: Manufacturers typically adhere to ISO 9001 for overall quality management and may provide certifications verifying chemical composition and particle size distribution. Industry standards like ASTM B213 ascertain flow properties, while ASTM B214 ensures particle size measurement accuracy. Additionally, suppliers may offer compliance documentation, including material safety data sheets and RoHS statements, to confirm environmental responsibility and consistent production practices.