CU8078 Spherical Copper Powder for 3D Printing 53-150 μm

Spherical Copper Powder for 3D Printing 53-150 μm Description

Enhance your additive manufacturing projects with our high-purity Spherical Copper Powder, specifically engineered for 3D printing applications. With a particle size range of 53–150 μm, it ensures consistent flowability, optimal packing density, and uniform layer thickness during the printing process. This copper powder is characterised by ≥99.9% purity, ensuring reliable mechanical performance, excellent thermal and electrical conductivity, and minimal contamination risks. Its uniform spherical shape provides reliability, reduced porosity, and improved dimensional accuracy in finished components.

Our Spherical Copper Powder meets stringent quality standards, employing rigorous inspection protocols to confirm particle uniformity and purity. Whether producing intricate electronics, advanced machinery parts, or high-strength prototypes, our copper powder delivers reliable results. For custom compositions or specialised requirements, our research team stands ready to collaborate and optimise your 3D printing process.

Spherical Copper Powder for 3D Printing 53-150 μm Applications

This spherical copper powder (53-150 μm) is noted for its excellent thermal and electrical conductivity, corrosion resistance, and mechanical strength. Its uniform morphology supports consistent flow, making it particularly suitable for precision manufacturing techniques. In 3D printing, powder metallurgy, or thermal spray processes, these properties support reliable performance and high-quality results across various demanding industrial applications.

1. Additive Manufacturing Applications

·         3D Printing: Utilises the powder’s high thermal and electrical conductivity to produce functional prototypes and end-use components with high surface finish and mechanical properties.

·         Selective Laser Melting: Utilises copper’s excellent heat transfer capabilities for efficient energy absorption, enabling dense parts with minimal porosity.

2. Powder Metallurgy Applications

·         Metal Injection Moulding: Takes advantage of copper’s unique flow characteristics to create intricate shapes with enhanced dimensional stability and strength.

·         Hot Isostatic Pressing: Ensures copper’s inherent corrosion resistance and conductivity are maintained in consolidated components with enhanced density.

3. Thermal Spray Applications

·         Plasma Spray Coatings: Utilises copper’s excellent conductivity and corrosion resistance to provide protective and conductive coatings on various substrates.

·         HVOF Coatings: Utilises the powder’s strong mechanical properties and uniform particle size for high-performance barrier layers against wear and oxidation.

Spherical Copper Powder for 3D Printing 53-150 μm Packaging

This high-quality spherical copper powder is carefully packaged in vacuum-sealed, moisture-resistant polyethylene bags, ensuring protection from humidity, air, and contamination. A secondary sturdy outer container, lined with an anti-oxidation additive, further preserves quality during transit. Custom packaging options—such as specialised volumes or additional protective layering—are available upon request to meet specific requirements and maintain the powder’s optimal performance.

Packaging: Vacuum sealed, Plastic Bottles, or Customised.

Spherical Copper Powder for 3D Printing 53-150 μm FAQs

Q1: What are the key material properties of Spherical Copper Powder for 3D Printing 53-150 μm?

A1: Spherical Copper Powder for 3D Printing 53-150 μm typically exhibits high purity (99%+), uniform shape, and particle size for consistent layering. Its spherical geometry improves flowability, reducing clogging and ensuring precise repeatability in additive manufacturing processes. Copper’s excellent thermal and electrical conductivity, combined with a stable oxide layer, makes it suitable for applications such as heat sinks, thermal management devices, and conductive components.

Q2: How can this Spherical Copper Powder for 3D Printing 53-150 μm be processed effectively?

A2: This copper powder can be used in powder bed fusion (PBF), directed energy deposition (DED), and binder jetting systems. Proper dehumidification, powder recycling protocols, and control of inert gas atmospheres help maintain powder integrity. Preheating the build platform improves powder flow and reduces residual stresses. Post-processing steps include heat treatment, machining, or surface finishing to meet specific dimensional and finishing requirements.

Q3: Which quality standards and certifications apply to Spherical Copper Powder for 3D Printing 53-150 μm?

A3: Spherical Copper Powder for 3D Printing 53-150 μm should comply with ASTM B823 and ISO standards governing metal powder characterisation. Manufacturers may certify purity, flow rate, particle size distribution, and oxygen content through analysis by scanning electron microscopy (SEM), laser diffraction, and chemical tests. Production facilities often follow ISO 9001:2015 guidelines to ensure consistent quality management. Additional certifications, such as RoHS compliance, may also be relevant.