CU9160 Copper-Molybdenum-Copper (CMC) Material

Copper-Molybdenum-Copper (CMC) Material Description

Copper-Molybdenum-Copper (CMC) is a high-performance composite designed to deliver excellent thermal conductivity while maintaining exceptional mechanical strength. Fabricated with a sturdy layered structure of copper and molybdenum, this advanced material offers low thermal expansion, high reliability, and corrosion resistance. Its efficient heat-dissipating capability makes it an ideal solution for demanding electronic applications where temperature stability is critical.

CMC is commonly utilised in aerospace, defence, and power electronics, where equipment must withstand harsh conditions. Built to meet stringent ISO standards, each CMC product undergoes rigorous testing to guarantee consistent quality and performance. These measures ensure a stable, reliable material that meets a wide range of engineering demands, from providing heat spreaders to supporting mission-critical components.

Copper-Molybdenum-Copper (CMC) Material Applications

Copper-Molybdenum-Copper (CMC) composites offer unique advantages due to their high thermal conductivity, matched thermal expansion, and superior mechanical strength. By combining copper’s excellent electrical properties with molybdenum’s robust structural stability, CMCs prove highly versatile across various sectors. The material’s ability to withstand extreme conditions while maintaining consistent performance contributes to its growing demand in industrial, research, and commercial applications worldwide.

1. Industrial Applications

·         Heat Sinks: High thermal conductivity aids in efficient heat dissipation in power electronics.

·         Structural Components: Combination of copper and molybdenum provides durability in harsh manufacturing environments.

2. Research Applications

·         Advanced Prototypes: Ideal for precision testing under extreme temperature conditions.

·         Analytical Instruments: Consistent thermal expansion simplifies accurate performance data gathering.

3. Commercial Applications

·         Electronic Packaging: Effective for reliable circuit protection due to its stable thermal properties.

·         Consumer Electronics: Enhanced conductivity ensures minimal energy losses and prolonged device lifespans.

Copper-Molybdenum-Copper (CMC) Material Packaging

Each Copper-Molybdenum-Copper (CMC) product is securely packaged in protective, moisture-resistant wrap and placed in durable, shock-absorbent containers. Materials should be stored in a clean, dry area with stable temperatures to ensure optimal performance. Vacuum-sealed or nitrogen-flushed packaging can be provided upon request to avoid contamination. Custom shapes, sizes, and labelling options are available to meet diverse application requirements.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Copper-Molybdenum-Copper (CMC) Material FAQs

Q1: What are the key material properties of Copper-Molybdenum-Copper (CMC) Material?

A1: CMC material offers an outstanding combination of high thermal conductivity, low coefficient of thermal expansion, and excellent structural stability. The copper layers provide effective electrical and thermal conduction, while the molybdenum core ensures dimensional stability even under extreme thermal cycling. Its thermal conductivity typically ranges from 180 to 250 W/mK, making it suitable for high-power electronic packages and advanced thermal management systems.

Q2: How should this product be handled and stored?

A2: Because the copper surfaces can oxidise, they should be kept in a dry, clean environment. Gloves should be worn to avoid contamination and skin oils on the copper layers. The material should be handled with care to prevent bending or warping, especially during cutting or assembly. Additionally, store CMC sheets in humidity-controlled packaging to ensure long-term product quality.

Q3: Which quality standards and certifications apply to Copper-Molybdenum-Copper (CMC) Material?

A3: Copper-Molybdenum-Copper (CMC) products generally comply with ISO 9001 for quality management, ensuring consistent production and traceability. Many suppliers also meet RoHS and REACH requirements for hazardous substance restrictions and environmental impact. In specialised industries, adherence to IPC standards may be necessary for electronics-grade materials. Additionally, some military or aerospace applications may require MIL-spec certifications to verify reliability and performance.

Related Information

1. Material Properties and Advantages

Copper-Molybdenum-Copper (CMC) stands out for its mechanical strength and consistent thermal performance. The integrated molybdenum layer, nestled between copper plates, creates a composite that effectively balances conductivity and thermal expansion, reducing the risk of warping and cracking during fluctuating temperature cycles. CMC’s strength-to-weight ratio also enables the material to endure high-stress environments, ensuring reliability within critical applications.

Thanks to its engineered composition, CMC can maintain structural coherence under harsh operating conditions. The presence of molybdenum contributes to effective heat dissipation, while the copper layers facilitate rapid conduction of thermal energy. This combination reduces the risk of component failure in devices that experience sudden spikes in temperature, directly translating to longer operational life and decreased maintenance costs.

2. Applications in Advanced Industries

Advanced microelectronics manufacturers often incorporate CMC in circuit substrates and power modules due to its proven ability to handle intense heat loads. In avionics and aerospace designs, where materials are exposed to rapid temperature fluctuations, this composite’s resilience and stability support reliable operation and minimise the chance of performance deterioration. Beyond electronics, automotive engineers also benefit from CMC’s capacity to withstand higher mechanical stresses while maintaining consistent power output.

Faster data processing systems depend on materials that offer thermal efficiency, and CMC fits that requirement by providing consistent response even under elevated temperature conditions. Its excellent dimensional stability and longevity equip devices, such as high-power laser diodes and semiconductor manufacturing equipment, with a foundation that meets demanding performance standards. By leveraging these attributes, organisations gain a competitive edge, streamlining production while ensuring the reliability of end products.