CY11158 Titanium Nitride (TiN) Coated Glass

Titanium Nitride (TiN) Coated Glass Description

Titanium Nitride (TiN) Coated Glass involves a metallic TiN layer deposited on a glass substrate to provide a barrier against chemical attack and physical stress. The TiN film is applied using controlled deposition techniques, which ensures minimal surface variation and consistent coating thickness. This consistency is critical for semiconductor processes where interface uniformity and contamination control are paramount.

Titanium Nitride (TiN) Coated Glass Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Titanium Nitride (TiN) Coated Glass Applications

Electronics
- Used as an insulating barrier in semiconductor interconnects to mitigate metal diffusion by leveraging the chemical inertness of the TiN layer.
- Applied as a component in optical systems where the inherent reflectivity and controlled surface finish reduce light scatter.

Semiconductor Manufacturing
- Employed as a coating on glass substrates in photolithography setups to improve pattern resolution by minimising light leakage and substrate variability.
- Frequently used in deposition systems where maintaining a clean, uniform interface is essential for device performance.

Titanium Nitride (TiN) Coated Glass Packing

The product is packaged in static shielding bags complemented by foam supports to prevent mechanical stress and contamination. Substrates are sealed in moisture-barrier envelopes and stored in a controlled environment during transit. Anti-contamination measures and cushioning materials are incorporated to maintain coating integrity. Customised packaging options are available to meet specific handling and storage requirements.

Additional Information

TiN coatings on glass substrates offer a practical solution for improving substrate durability in technologically demanding environments. By enhancing chemical inertness and reducing surface roughness, these coatings support processes that require high precision. The deposition process and subsequent quality control measures are designed to maintain strict adherence to technical specifications.

Understanding the interplay between the metallic TiN layer and the underlying glass is critical for optimising performance in semiconductor applications. Advanced inspection methods and controlled production parameters contribute to achieving a consistent and effective protective coating, which is essential for modern electronic material processing.