CY11163 Aluminum (Al) Coated Silicon Wafer

Aluminium (Al) Coated Silicon Wafer Description

Aluminium (Al) Coated Silicon Wafer is a silicon substrate that incorporates a thin aluminium film via vapour-phase deposition. The controlled coating process enhances surface characteristics critical for semiconductor processing. The aluminium layer acts as an electrical conductor and protective barrier against oxidation, which improves device processing and overall operational performance in microfabrication environments.

Aluminium (Al) Coated Silicon Wafer Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Aluminium (Al) Coated Silicon Wafer Applications

1.       Semiconductor Fabrication
   - Used as a critical component in IC fabrication to enhance metallisation interfaces by leveraging the conductive aluminium layer.
   - Applied as a base substrate in advanced lithography systems to achieve uniform material deposition and process stability.

2.       Microelectronics
   - Serves as a wafer platform in microelectronic device manufacturing to improve electrical interconnect performance through the aluminium coating.
   - Frequently used for sensor arrays where consistent surface properties are needed to ensure accurate signal response and device longevity.

Aluminium (Al) Coated Silicon Wafer Packing

The wafers are packaged in antistatic carriers and sealed within clean, moisture-resistant pouches to prevent contamination. These containers are further cushioned with foam inserts, ensuring minimal handling stress during transit. Packaging is designed to meet stringent cleanroom standards and can be customised with specific labelling and compartmentalisation to facilitate safe storage and easy handling.

Additional Information

Silicon wafers remain a fundamental component in semiconductor manufacturing due to their excellent thermal and electrical properties. The integration of an aluminium coating improves functionality by providing a conductive layer that also serves as a barrier against oxidation, which is critical for maintaining performance during high-temperature processing.

Advanced deposition techniques, such as sputtering and vapour-phase methods, allow for precise control over layer thickness and uniformity. These processes contribute to the reproducibility and efficiency required for fabricating complex microelectronic devices, ensuring compatibility with standard industry protocols and equipment.