CY8552 Silicon (Si) Crystal Substrate (110) Dia. 4 inch

Silicon (Si) Crystal Substrate (110) Dia. 4 inch Description

These high-purity Silicon (Si) Crystal Substrates feature a (110) orientation and a 4-inch diameter, making them suitable for advanced semiconductor research and production. Engineered from single-crystal silicon with a uniformly controlled doping profile, they exhibit excellent crystallographic uniformity, low defect density, and superior thermal conductivity. The (110) orientation facilitates unique electronic properties required in specialised MEMS devices and transistor architectures, enabling precise etching and detailed micromachining processes.

Manufactured under strict quality standards, each wafer meets or exceeds SEMI guidelines for surface roughness, flatness, and defect control. Rigorous inspection procedures ensure consistent thickness and optimal surface quality, providing the reliability required in materials research and device fabrication. Trust these (110)-oriented Si substrates to deliver high performance for a wide range of scientific and industrial applications.

Silicon (Si) Crystal Substrate (110) Dia. 4 inch Applications

Silicon (Si) Crystal Substrate (110), 4 inch in diameter, provides a precisely oriented platform crucial for numerous technological innovations. Its unique crystal structure delivers superior electron mobility, thermal conductivity, and mechanical strength, making it invaluable in various applications. Whether powering advanced semiconductor devices or supporting precision instruments, this substrate reliably meets the performance requirements of contemporary technology.

1. Industrial Applications

·        Electronics and Semiconductors: Enables reliable integrated circuits and sensor arrays, leveraging excellent charge carrier mobility.

·        Precision Automotive Sensors: Provides consistent mechanical properties for advanced motion detectors, improving vehicle safety.

·        Chemical Processing Equipment: Withstands harsh environments and ensures stable performance in industrial-scale reactors.

2. Research Applications

·        Biomedical Device Prototypes: Offers a biocompatible and stable base for developing diagnostic tools.

·        Thin-Film Deposition Studies: Facilitates accurate experimentation in materials science, owing to its well-defined crystal orientation.

·        Optical and Photonic Investigations: Supports precise waveguide and laser studies due to consistent refractive properties.

3. Commercial Applications

·        Telecommunications Components: Delivers high-frequency performance critical for network systems and signal processing.

·        Renewable Energy Solutions: Acts as a foundation for solar cell development, enhancing efficiency and durability.

·        Consumer Electronics Production: Ensures reliable and high-quality substrate materials for flat-panel displays and sensors.

Silicon (Si) Crystal Substrate (110) Dia. 4 inch Packaging

Each 4-inch (110) Silicon Crystal Substrate is individually sealed in a static-free pouch, surrounded by foam inserts for protection against shock and contamination. They should be stored in a clean, low-humidity environment, ideally between 15°C to 25°C, to preserve surface integrity. An additional protective layer prevents particulate buildup. Custom labeling, specialised marking, or unique packaging configurations are available upon request to meet specific handling or operational requirements.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Silicon (Si) Crystal Substrate (110) Dia. 4 inch FAQs

Q1: What are the key material properties of Silicon (Si) Crystal Substrate (110) Dia. 4 inch?

A1: Silicon (Si) crystal substrates with (110) orientation are known for their uniform crystal structure, making them valuable for advanced semiconductor applications. Typically, the 4-inch diameter wafers have tightly controlled thickness (e.g., 525 ± 25 µm) and a resistivity range that depends on doping. They exhibit high thermal conductivity (approximately 149 W/m·K) and low defect densities. Their (110) orientation supports certain specialised device designs, providing distinct mechanical and electrical properties.

Q2: How should this product be handled and stored?

A2: These wafers should be handled in a cleanroom environment using filtered, particle-free air. Direct contact with bare skin must be avoided; instead, use antistatic gloves or vacuum wands. The wafers are typically stored in wafer carriers or cassettes that protect the surfaces from scratching. Maintaining a stable, low-humidity environment (around 40% relative humidity) and moderate temperature (approximately 20-25°C) helps prevent contamination, oxidation, and mechanical damage.

Q3: Which quality standards and certifications apply to Silicon (Si) Crystal Substrate (110) Dia. 4 inch?

A3: Silicon wafer production generally adheres to SEMI M1 standards, which govern wafer thickness, diameter, and flatness. Many suppliers are also certified under ISO 9001 for quality management, ensuring strict process controls and traceability at each manufacturing stage. Additional standards like ISO 14001 may apply to environmental management. Compliance with these requirements verifies consistent wafer quality, minimal defects, and reliable performance for use in semiconductor device fabrication or research applications.

Related Information

1. Applications in Advanced Industries

Specialised semiconductor devices and advanced sensors frequently rely on Silicon (Si) Crystal Substrate (110) Dia. 4 inch to achieve reliable performance. The (110) crystalline orientation offers distinct electrical and mechanical properties, making it particularly suitable for components requiring high-speed signal processing. Given that the wafer has a 4 inch diameter, it is large enough to accommodate various intricate designs yet remains compatible with a wide range of existing fabrication equipment in advanced technology sectors.

Many leading-edge fields, such as high-efficiency solar cell manufacturing and power electronics, benefit from the nature of this specific substrate. Its crystalline structure supports enhanced electrical conductivity in applications where consistent current flow and reduced energy loss are critical. This has positioned the (110) silicon wafer as a preferred solution for technologies that demand stability, miniaturisation, and high reliability.

2. Research and Development

Research institutions continuously explore methods and materials to improve the functionality of (110) silicon substrates. This ongoing work includes optimising the doping process to achieve precise carrier concentrations, as well as investigating new ways to improve surface smoothness and reduce impurities. Through these efforts, laboratories around the world advance performance across a variety of applications that benefit from silicon’s unique electrical and mechanical properties.

Experiments often involve the modification of wafer thickness and orientation to assess their impact on device efficiency. (110) oriented silicon, in particular, is of growing interest because it can accommodate specialised wafer bonding approaches for advanced microsystems and sensor arrays. These innovations contribute to higher yields and increased productivity in multiple research and industrial environments.