CY9445 Copper Single Crystal Substrates Cu Substrate (100), 10x10x1 mm, SSP

Copper Single Crystal Substrates Cu Substrate (100), 10x10x1 mm, SSP Description

Copper Single Crystal Substrates Cu Substrate (100), 10x10x1 mm, SSP are fabricated from high-purity copper using directional solidification and annealing processes. The (100) crystallographic orientation is maintained throughout processing, supporting uniform lattice structures critical for semiconductor device integration. The precise dimensions aid compatibility with standard fabrication equipment. Advanced inspection methods, including diffraction analysis and surface profilometry, verify crystallographic and dimensional accuracy to minimise defects and support device performance.

Copper Single Crystal Substrates Cu Substrate (100), 10x10x1 mm, SSP Applications

Electronics Applications
- Use as a conductive platform in high-density interconnect systems to achieve optimised current distribution by leveraging copper’s intrinsic thermal and electrical conductivity.
- Applied as a heat sink in RF modules to provide effective thermal dissipation by leveraging high thermal conductivity.

Semiconductor Processing
- Used as a base for epitaxial layer deposition in semiconductor wafer fabrication to achieve minimal interface defects by leveraging its monocrystalline uniformity.
- Applied as a substrate in integrated circuit production to achieve precise lattice matching by leveraging the (100) crystal orientation.

Industrial Components
- Used as electrodes in precision sensing devices to achieve stable signal performance by leveraging controlled crystallographic characteristics.
- Applied in microfabrication setups to achieve reduced scattering losses by leveraging low defect density.

Copper Single Crystal Substrates Cu Substrate (100), 10x10x1 mm, SSP Packing

Copper Single Crystal Substrates are packaged individually in anti-static trays with foam inserts to cushion against mechanical stress. The substrates are sealed in moisture-resistant, low-lint pouches and stored in a temperature-controlled environment. Handling guidelines require clean-room conditions to minimise contamination. Custom packaging options, including additional labelling and compartmentalisation, are available to accommodate specific storage and transport requirements.

Frequently Asked Questions

Q1: How does the (100) crystallographic orientation impact substrate integration?
A1: The (100) orientation enables uniform lattice properties that facilitate predictable epitaxial growth, reducing interface defects during semiconductor processing. This control supports improved integration with subsequent device layers.

Q2: What quality control measures are implemented during production?
A2: The manufacturing process includes electron backscatter diffraction, surface profilometry, and metallographic analysis to verify crystallographic alignment and dimensional tolerances, thereby reducing defect occurrences.

Q3: What are the recommended handling protocols for these substrates?
A3: The substrates should be handled in clean-room environments using static-dissipative tools and gloves. Careful storage in moisture-controlled, low-dust conditions is advised to prevent contamination or surface damage.

Additional Information

Monocrystalline copper substrates play a critical role in microfabrication processes, particularly in applications requiring high fidelity in crystalline structure. Their single crystal nature minimises grain boundary effects that can lead to unpredictable electronic behaviour. Understanding the metallurgical processes, such as annealing and directional solidification, helps in optimising such substrates for integration in sensitive device architectures.

Advancements in electron microscopy and diffraction techniques have improved the ability to assess and control crystallographic properties during production. These analytical methods contribute to a broader understanding of crystal growth dynamics, enabling the consistent production of substrates that meet stringent specifications required for modern semiconductor applications.