PE14014 PEEK Film

Catalogue Number	PE14014
Material	PEEK
Form	Film

PEEK Film is a high-performance polymer film developed for advanced composite and engineering applications. Manufactured through precise melt extrusion and subsequent thermal treatment processes, the film delivers consistent chemical inertness and high-temperature stability. Stanford Advanced Materials (SAM) utilises detailed spectroscopic and mechanical testing during production to verify thickness uniformity and molecular orientation. These stringent process controls help ensure the film meets rigorous industrial standards.
Related Products: PEEK Sheet, Polypropylene Sheet (PP Sheet), PBI Sheet

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FAQ

How does the thermal stability of PEEK Film affect its performance in high-temperature applications?

The thermal stability of PEEK Film enables it to withstand elevated temperatures without significant degradation. This property is crucial when the film is used in environments where temperature fluctuations occur, such as in electronic circuit insulation or industrial processes. Its stability helps maintain dimensional integrity and chemical resistance during operation.

What factors influence the mechanical properties of PEEK Film in flexural applications?

The mechanical properties of PEEK Film in flexural applications depend on processing conditions such as extrusion temperature and cooling rate. These parameters affect molecular orientation and crystallinity, which in turn influence flexural strength and modulus. Consistent processing helps achieve the desired balance between toughness and stiffness.

In what ways can the volume resistivity characteristic of PEEK Film be beneficial?

High volume resistivity in PEEK Film minimises electrical conduction, making it suitable for insulation applications. This property is especially beneficial in high-voltage environments or in electronic devices where electrical isolation is required. The inherent chemical inertness further supports its performance in aggressive operating conditions.

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Parameter	Value
Material	PEEK
Form	Film
Dimensions	Customised
Tensile Strength	95 MPa
Tensile Modulus	3.8 GPa
Elongation at Break	35
Flexural Strength	155 MPa
Flexural Modulus	3.5 GPa
Melting Point	343℃
Glass Transition Temperature	143℃
Heat Deflection Temperature	152℃
Coefficient of Thermal Expansion	45 ppm·K^-1
Thermal Conductivity	0.29 W/(m·K)
Dielectric Strength	20 kV/mm
Dielectric Constant	3.0
Surface Resistivity	10¹⁵
Melt Flow Index	6-10 g/10 min
Density	1.3 g/cm³

Parameter	Value
Material	PEEK
Form	Film
Dimensions	Customised
Tensile Strength	95 MPa
Tensile Modulus	3.8 GPa
Elongation at Break	35
Flexural Strength	155 MPa
Flexural Modulus	3.5 GPa
Melting Point	343℃
Glass Transition Temperature	143℃
Heat Deflection Temperature	152℃
Coefficient of Thermal Expansion	45 ppm·K^-1
Thermal Conductivity	0.29 W/(m·K)
Dielectric Strength	20 kV/mm
Dielectric Constant	3.0
Surface Resistivity	10¹⁵
Melt Flow Index	6-10 g/10 min
Density	1.3 g/cm³

PE14014 PEEK Film

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FAQ

How does the thermal stability of PEEK Film affect its performance in high-temperature applications?

What factors influence the mechanical properties of PEEK Film in flexural applications?

In what ways can the volume resistivity characteristic of PEEK Film be beneficial?

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