ST11176 Cobalt Planar Target, Co Target

Cobalt Planar Target, Co Target Description

Cobalt Planar Target, Co Target is manufactured from elemental cobalt (Co) with customised dimensions to meet diverse sputtering system requirements. The target is engineered to promote uniform plasma distribution and consistent film deposition. Its controlled chemical composition and physical properties minimise particulate generation during sputtering, ensuring performance consistency in semiconductor and coating processing applications.

Cobalt Planar Target, Co Target Characteristics

The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Cobalt Planar Target, Co Target Applications

1.       Electronics
   - Used as a sputtering target in semiconductor deposition to achieve uniform film formation by leveraging controlled cobalt composition.
   - Applied in magnetic storage device fabrication to attain consistent magnetic properties through precise coating thickness control.

2.       Industrial
   - Employed in coating systems for wear-resistant layers to improve surface durability by utilising cobalt's high melting point.
   - Served as a component in thin film filters for optical systems to achieve precise density control and enhanced performance.

3.       Automotive
   - Utilised in the deposition of decorative coatings on interior components to ensure uniform appearance and adhesion by using consistent target composition.

Cobalt Planar Target, Co Target Packing

The target is packaged using anti-static, moisture-resistant materials and placed in a rigid, shock-absorbent container. Protective foil and foam inserts prevent particulate contamination and mechanical damage. The packaging is designed for storage in a controlled environment, ensuring no alterations in material properties. Custom packaging options, including labelling and compartmentalised containers, are available on request.

Additional Information

Cobalt sputtering targets play a critical role in thin film deposition technologies used in microelectronics and surface engineering. The controlled processing of cobalt into planar targets is essential for maintaining a stable plasma environment during sputtering, which is pivotal for achieving high-quality film uniformity.

Advances in material science and precise machining technologies have enabled the production of targets with strict compositional and dimensional tolerances. These improvements facilitate enhanced performance in applications that demand high precision and efficiency, contributing to the operational success in semiconductor, industrial, and automotive sectors.