ST11181 Chromium Aluminum Sputtering Target, CrAl Target

Chromium Aluminium Sputtering Target, CrAl Target Description

Chromium Aluminium Sputtering Target, CrAl Target is composed of a carefully balanced chromium–aluminium alloy optimised for thin film deposition processes. The target's engineered microstructure promotes consistent film growth and uniformity on various substrates. Its controlled alloy composition is critical for maintaining reproducible deposition rates and film properties in semiconductor and display manufacturing. This product meets the high standards required by industrial sputtering systems.

Chromium Aluminium Sputtering Target, CrAl Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Chromium Aluminium Sputtering Target, CrAl Target Applications

Electronics
- Used as a sputtering target in semiconductor deposition systems to achieve uniform thin metal films by leveraging its consistent alloy composition. 

Industrial
- Applied as a coating source in manufacturing processes to enhance surface properties by utilising its stable microstructure and predictable deposition behaviour. 

Optical Components
- Serves as the material for depositing reflective and conductive coatings on optical devices to fine-tune reflective properties with controlled film thickness.

Chromium Aluminium Sputtering Target, CrAl Target Packing

The target is packaged in a foam-lined, anti-static container and sealed within a vacuum bag to protect against mechanical impact and contamination during transit. It is recommended to store the target in a dry, temperature-controlled environment away from moisture and dust. Additional customisation, including barrier layers and custom labelling, is available to meet specific handling and storage requirements.

Additional Information

Sputtering targets play a critical role in thin film deposition processes across various industrial sectors. The precise control of material composition facilitates the production of films with uniform thickness and enhanced adhesion. These targets are fundamental components in processes such as semiconductor fabrication and optical coating, where material consistency is paramount.

Advancements in target production techniques have contributed to improved performance in deposition systems. Understanding the interplay between material properties and sputtering behaviour helps engineers optimise deposition parameters, leading to refined film characteristics and enhanced device performance. This broader context supports continued innovation in material processing and application design.