ST11201 Nickel Rotary Target, Ni Target

Nickel Rotary Target, Ni Target Description

Nickel Rotary Target, Ni Target is a sputtering target manufactured from high-purity elemental nickel (Ni). The target's rotary configuration ensures even material erosion and efficient heat dissipation during the sputtering process. Customised dimensional specifications support compatibility with various deposition systems, promoting consistent film thickness and uniform deposition. These technical features contribute directly to process stability and equipment integration.

Nickel Rotary Target, Ni Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Nickel Rotary Target, Ni Target Applications

1.       Electronics
   - Used as a sputtering source in semiconductor thin-film deposition to achieve uniform film growth by leveraging the target's rotary motion.
   - Applied as the coating element in display panel manufacturing to ensure even coverage through consistent erosion.

2.       Industrial Processing
   - Employed as a coating target in surface modification systems to enhance corrosion resistance by utilising the even deposition provided by rotary action.
   - Used in vacuum deposition systems for manufacturing corrosion-resistant components, attaining uniform film thickness and improved process control.

3.       Research & Development
   - Implemented in analytical sputtering experiments to study deposition dynamics by applying controlled erosion characteristics.
   - Utilised in laboratory-scale projects to investigate the effects of target design on film morphology, benefiting from the customisable dimensions.

Nickel Rotary Target, Ni Target Packing

Nickel Rotary Target, Ni Target is packaged in protective anti-static wrapping and secured within foam-lined containers to prevent mechanical damage and surface contamination. The packaging is designed to minimise exposure to moisture and airborne particulates. Recommended storage is in a controlled, dry environment. Options for customised packaging, including vacuum sealing and specific labelling, are available upon request.

Additional Information

Nickel remains a critical material in the field of sputtering deposition due to its excellent electrical and thermal properties. Understanding the behaviour of nickel during high-energy processes provides insights into optimising film uniformity and adhesion in various industrial applications.

In addition, the design of sputtering targets plays an important role in tailoring deposition characteristics. Advances in rotary target configurations allow for consistent erosion and controlled material transfer, supporting high-precision film fabrication in electronics, surface engineering, and research environments.