ST11211 Tin Planar Target, Sn Target

Tin Planar Target, Sn Target Description

Tin Planar Target, Sn Target is a sputtering target made from pure tin (Sn) and is engineered for uniform thin film deposition. Its customisable dimensions enable integration with various sputtering systems, ensuring adaptability to different coating processes. The planar form minimises edge effects and particulate generation during deposition. This technical design supports consistent film performance, making it suitable for applications in semiconductor processing and surface coating technologies.

Tin Planar Target, Sn Target Characteristics

The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Tin Planar Target, Sn Target Applications

Electronics
- Used as a sputtering target in semiconductor deposition chambers to achieve uniform thin film coating by leveraging its planar surface finish.
- Applied as a component in display manufacturing systems to ensure consistent conductive layer formation through controlled material purity.

Industrial
- Serves as a coating material in the fabrication of reflective surfaces by providing a homogeneous tin layer that minimises defects.
- Frequently used in thin film sensor production to enhance signal consistency through precise film thickness control.

Automotive
- Implemented in the production of electronic control units by delivering a stable tin layer for circuit reliability through tightly controlled deposition parameters.

Tin Planar Target, Sn Target Packing

Tin Planar Target, Sn Target is packaged in anti-static, moisture-barrier bags and secured within cushioned, foam-lined containers. The packaging employs contamination control measures to prevent particulate ingress and oxidation during transport. Storage in a temperature-controlled environment is recommended. Custom packaging options, including vacuum sealing and specialised labelling, are available to meet specific handling requirements.

Additional Information

Tin, represented chemically as Sn, plays a fundamental role in various metallurgical and deposition processes. Its properties, including a relatively low melting point and high purity requirement, make it a critical material in sputtering applications. Understanding the material behaviour under thermal and mechanical stress is essential for achieving consistency during film deposition.

In materials science, the characteristics of tin targets directly influence the film microstructure and adhesion in coating processes. Advances in manufacturability and surface treatment techniques continue to enhance tin's functionality in electronic and industrial device production, contributing to overall process efficiency and product performance.