ST11214 Tantalum Planar Target, Ta Target

Tantalum Planar Target, Ta Target Description

Tantalum Planar Target, Ta Target is manufactured from high-purity tantalum with a carefully controlled planar surface finish optimised for sputtering. The product's tailored dimensions ensure compatibility with standard deposition systems while its controlled microstructure minimises particulate contamination during coating processes. This facilitates efficient layer formation in semiconductor fabrication and other industrial applications where uniform film deposition is critical.

Tantalum Planar Target, Ta Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Tantalum Planar Target, Ta Target Applications

1.       Electronics
   - Used as a sputtering target in semiconductor deposition systems to achieve uniform thin film layers by leveraging the material's controlled microstructure. This approach minimises surface defects and enhances coating consistency.

2.       Industrial Coatings
   - Applied as the primary target in physical vapor deposition systems for producing durable decorative or functional coatings. Its high purity and stable melting point facilitate consistent film formation, which is critical for performance in industrial settings.

Tantalum Planar Target, Ta Target Packing

This tantalum planar target is packaged in custom-designed, anti-static containers with foam cushioning to mitigate mechanical shocks and contamination risks. Each target is sealed in a moisture-barrier bag with desiccants to control humidity. Custom packaging options, including compartmentalised foam inserts and labelled boxes, are available. For optimal preservation, store targets in a temperature-controlled, dust-free environment.

Additional Information

Tantalum is a refractory metal known for its corrosion resistance and high melting point. Its unique properties make it a critical material in sputtering targets for thin film deposition processes. Understanding the relationship between microstructure control and material purity is essential for achieving uniform film growth in semiconductor and industrial applications.

Advancements in materials processing techniques continue to enhance the performance of sputtering targets. Researchers and engineers focus on optimising parameters such as grain size and surface finish to improve deposition efficiency and film quality. These efforts contribute to the broader field of non-ferrous metal applications, where precision in material characteristics is paramount.