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ST11462 Aluminum Copper Planar Sputtering Target (AlCu)

Catalogue Number ST11462
Composition AlCu
Shape Rectangular
Form Target
Purity Al+Cu: ≥99%

Aluminum Copper Planar Target, AlCu Target is engineered for physical vapour deposition processes with a uniform planar surface that supports consistent sputtering. Manufactured by Stanford Advanced Materials (SAM), the product undergoes routine optical inspection and dimensional metrology to verify surface flatness and compositional consistency. These measures are integrated into SAM's production process to maintain precise material characteristics for controlled thin-film deposition.

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Description
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FAQ

Which deposition methods are compatible with the Aluminium Copper Planar Target?

The target is suited for sputtering in physical vapour deposition systems. Its planar geometry supports uniform plasma distribution, which contributes to even material erosion. Adjustments in power density and gas pressure may be required based on specific system configurations.

How does the AlCu composition affect target performance?

The defined AlCu alloy composition ensures a consistent sputtering rate and stable thin-film properties. This predictability is crucial for processes that demand uniform coating thickness and reproducible deposition profiles in semiconductor and electronic manufacturing.

What are the recommended storage conditions for this target?

The target should be stored in a dry, temperature-controlled environment to prevent surface oxidation and contamination. It is advisable to keep the target in its original, sealed packaging until installation. Contact us for detailed handling procedures if further clarification is needed.

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United Kingdom

    Purity

    99.9%

    • 99.9%
    • 99.5%
    • 99.99%
    • 99.999%
    • Other
    Diameter

    2''

    • 2''
    • 3''
    • 4''
    • 5''
    • 6''
    • Other
    Thickness

    0.25''

    • 0.25''
    • 0.125''
    • All
    • Other
    Bonding

    Yes

    • Yes
    • No
    • Other
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