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  • ST11470 Nickel Cobalt Iron Planar Sputtering Target (NiCoFe)

    • ST11470 Nickel Cobalt Iron Planar Sputtering Target (NiCoFe)

    Catalogue Number ST11470
    Composition NiCoFe
    Shape Rectangular
    Form Target
    Purity Ni+Co+Fe: ≥99%

    Nickel Cobalt Iron Planar Target, NiCoFe Target is produced using a controlled alloy composition suitable for sputtering deposition processes. Stanford Advanced Materials (SAM) utilises advanced surface analysis techniques such as X-ray diffraction and scanning electron microscopy to monitor material uniformity and flatness throughout manufacturing. This approach minimises defects by adhering to stringent in‑process inspection protocols, thereby ensuring a controlled and uniform target surface for film deposition applications.

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    FAQ

    What deposition parameters are recommended when using this NiCoFe Target?

    Adjust process power and gas flow to suit the sputtering system. Higher power density accelerates the deposition rate, while controlled argon pressure maintains a uniform film. Contact us for tailored process guidelines.

    How does the alloy composition of NiCoFe affect film uniformity?

    The controlled NiCoFe composition ensures uniform ion bombardment during deposition. This helps produce films with consistent microstructural properties, reducing contamination risks and enhancing film homogeneity.

    Is the target compatible with standard sputtering equipment?

    Yes, the planar geometry and standardised dimensions of the NiCoFe Target ensure compatibility with typical sputtering system setups. Process adjustments may be required to optimise deposition outcomes.

    LAST RECOMMENDATION

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    Send us an inquiry today to learn more and receive the latest pricing. Thank you!

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      Purity

      99.9%

      • 99.9%
      • 99.5%
      • 99.99%
      • 99.999%
      • Other
      Diameter

      2''

      • 2''
      • 3''
      • 4''
      • 5''
      • 6''
      • Other
      Thickness

      0.25''

      • 0.25''
      • 0.125''
      • All
      • Other
      Bonding

      Yes

      • Yes
      • No
      • Other
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