ST7959 Molybdenum Sputtering Target 99%, Dia. 6 inch

Molybdenum Sputtering Target 99%, Dia. 6 inch Description

Our Molybdenum Sputtering Target, with a 99.0% purity level, offers exceptional material integrity for high-performance thin film deposition applications. This six-inch diameter target is composed of top-quality molybdenum, renowned for its outstanding electrical conductivity, high melting point, and superior corrosion resistance. Its mechanical strength and thermal stability ensure consistent, reliable results, even under rigorous sputtering conditions.

Meticulously crafted under stringent quality control standards, this target exhibits a uniform grain structure that promotes stable sputtering rates and optimal film thickness uniformity. Ideal for use in semiconductor manufacturing, solar cell production, and various coating processes, our Molybdenum Sputtering Target delivers reliable performance while meeting demanding industry requirements. Trust in its excellent properties and consistent quality for precise and efficient thin film deposition.

Molybdenum Sputtering Target 99%, Dia. 6 inch Applications

This Molybdenum sputtering target, featuring 99% purity and a 6-inch diameter, provides remarkable mechanical strength, high melting point, and superior thermal conductivity. It is widely used in a variety of industries that demand precision and reliability in thin film deposition. Its corrosion resistance and stable electrical properties make it an essential component for advanced coatings in the semiconductor, electronics, and optics fields. Below are some key areas where it finds significant application.

1. Thin Film Deposition Applications

·         PVD Coating: Utilised for creating uniform, high-density coatings with excellent adhesion and durability.

·         Magnetron Sputtering: Ensures stable plasma generation and consistent film thickness due to molybdenum’s high temperature tolerance.

·         Ion Beam Sputtering: Facilitates precise film thickness control and high target utilisation, reducing production costs.

2. Semiconductor Applications

·         Gate Electrode Formation: Provides reliable electrical performance and longevity thanks to its stable conductivity.

·         Barrier Layers: Offers effective diffusion control in device structures, enhancing component reliability and performance.

·         Chip Packaging Elements: Contributes to robust packaging solutions by withstanding thermal stresses in high-tech devices.

3. Optical Coating Applications

·         Laser Mirrors: Minimises thermal distortion and resists laser-induced damage, ensuring dependable mirror performance.

·         Beam Splitters: Enables precise reflective/transmissive ratios by leveraging molybdenum’s consistent sputtering behaviour.

·         Filter Coatings: Delivers excellent optical clarity and uniform layer thickness in specialised filters.

Molybdenum Sputtering Target 99%, Dia. 6 inch Packaging

Our Molybdenum Sputtering Target (99%, 6-inch diameter) is first enveloped in plastic film with desiccant to keep moisture away, then padded with polyethylene foam for impact protection. Next, it is vacuum-sealed in an aluminium foil pouch to prevent oxidation and contamination. Finally, it is shipped in a robust, corrugated carton. Custom labeling, additional protective layers, and alternative container materials are available upon request.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Molybdenum Sputtering Target 99%, Dia. 6 inch FAQs

Q1: What are the key material properties of Molybdenum Sputtering Target 99%, Dia. 6 inch?

A1: Molybdenum Sputtering Target 99%, Dia. 6 inch is typically characterised by a high melting point (~2,620°C), excellent thermal conductivity, and superb mechanical strength at high temperatures. With a purity of 99%, it exhibits low impurity levels that support consistent sputtering performance and uniform film deposition. The diameter of 6 inches provides ample surface area for efficient coating processes and extends target life, reducing the frequency of target replacements.

Q2: How can this Mo sputtering target be processed or fabricated?

A2: Molybdenum targets can be manufactured through powder metallurgy, hot isostatic pressing (HIP), or vacuum sintering, which ensures optimal density and grain refinement. After the initial densification process, the target is frequently machined to the desired thickness and polished to produce a smooth surface. Careful handling is essential to avoid contamination and microstructural damage, guaranteeing consistent film properties and reliable performance during sputtering applications.

Q3: Which quality standards and certifications apply to Molybdenum Sputtering Target 99%, Dia. 6 inch?

A3: These molybdenum sputtering targets typically conform to stringent ASTM B386 or equivalent material specifications. The manufacturing processes often comply with ISO 9001 quality management systems, ensuring traceability in raw materials, production parameters, and final inspection. Purity verification may be conducted using ICP-MS or GD-MS analyses. Additionally, comprehensive documentation on chemical composition, dimensional measurements, and mechanical properties is provided to maintain industry-leading quality and product consistency.

Related Information

1. Raw Materials - Mo Materials

Mo is a valuable material used in various sputtering applications. It is extracted and purified through advanced processing operations. Stanford Advanced Materials sources high-grade materials from reliable suppliers, ensuring quality and consistency in our sputtering target products.

2. Sputtering Target Manufacturing

Several methods are used to produce Mo sputtering targets, including Powder metallurgy. Each method results in different target characteristics such as density, grain structure, and surface properties. The manufacturing method is selected based on the intended application requirements and performance specifications.