ST9140 High Purity Copper Sputtering Target (5N)

High Purity Copper Sputtering Target (5N) Description

Our High Purity Copper Sputtering Target (5N) comprises 99.999% pure copper, ensuring minimised impurities and exceptional material stability. This ultra-clean composition enhances conductivity and improves thin-film uniformity, making it an ideal choice for demanding applications in semiconductors, data storage, and advanced electronics manufacturing. Engineered for consistent performance, the target promotes efficient material utilisation and consistent adhesion in physical vapour deposition (PVD) processes.

Manufactured under strict quality control systems, each High Purity Copper Sputtering Target adheres to rigorous industry standards and undergoes comprehensive testing for purity, density, and microstructure. The result is a highly reliable product that contributes to high coating performance, extended target life, and reduced contamination risks. Choose this 5N copper target for enhanced process efficiency and dependable results in your critical production requirements.

High Purity Copper Sputtering Target (5N) Applications

High Purity Copper Sputtering Targets (5N) provide excellent conductivity, good thermal properties, and superior film uniformity for critical coating applications. Achieving 99.999% purity levels, these targets ensure consistent deposition with minimal contamination. Their exceptional performance makes them essential in a wide range of industries, advanced research efforts, and everyday consumer products, supporting advancements in technology globally.

1. Industrial Applications

·         Semiconductor Fabrication: Enables precise thin-film deposition for microelectronics with minimal impurity interference.

·         Automotive Electronics: Enhances vehicle sensor performance through high electrical conductivity and stable coatings.

2. Research Applications

·         Advanced Metallurgy Studies: Facilitates investigation of copper’s electrical and thermal properties in controlled conditions.

·         Nanotechnology Exploration: Allows creation of uniform nanoscale coatings vital for innovative device prototypes.

3. Commercial Applications

·         Consumer Electronics Manufacturing: Improves reliability in smartphones, tablets, and wearable devices through stable copper coatings.

·         Display Panel Production: Contributes to bright, durable, and energy-efficient screens by delivering high purity copper layers.

High Purity Copper Sputtering Target (5N) Packaging

Each High Purity Copper Sputtering Target (5N) is individually vacuum-sealed in a moisture-resistant film, surrounded by anti-static foam, and placed in a rigid casing. This protects against oxidation, dust, and physical damage during transit. Store in a clean, low-humidity environment, away from direct sunlight and extreme temperatures to preserve purity. Customisation options include specialised foam inserts, double-layer packaging, and labelling to accommodate various sizes, shapes, and customer requirements.

Packaging: Vacuum sealed, Wooden Box, or Customised.

High Purity Copper Sputtering Target (5N) FAQs

Q1: What are the key material properties of High Purity Copper Sputtering Target (5N)?

A1: High Purity Copper Sputtering Target (5N) typically contains 99.999% pure copper, which ensures minimal contamination from trace elements. Its high electrical conductivity, excellent thermal performance, and fine, uniform microstructure make it optimal for thin film deposition in semiconductor and related applications. The 5N grade indicates very low levels of impurities, leading to reduced particle generation and superior film uniformity, which is crucial for precise device fabrication.

Q2: How should this product be handled and stored?

A2: High Purity Copper Sputtering Targets (5N) should be handled with clean gloves to prevent oxidation and contamination. They should be stored in a dry, controlled environment, preferably vacuum-sealed or in inert gas packaging to minimise surface oxidation. Avoid direct contact with oils, moisture, or acids. Clean the target surface gently with a lint-free cloth or approved solvent before installation to maintain performance.

Q3: Which quality standards and certifications apply to High Purity Copper Sputtering Target (5N)?

A3: High Purity Copper Sputtering Targets (5N) are commonly produced under ISO 9001-certified quality management systems to ensure consistent purity and performance. Manufacturers may also provide Material Test Reports (MTRs) verifying chemical composition, trace element analysis, and mechanical properties. In many cases, the targets comply with RoHS and REACH directives, reflecting stringent environmental standards. Additionally, purity is confirmed through advanced analytical methods such as ICP-OES or GDMS testing.

Related Information

1. Material Properties and Advantages

High Purity Copper Sputtering Target (5N) stands out for its remarkably low impurity levels, ensuring minimal contamination in thin-film applications. This high-grade copper provides superior electrical conductivity, which is critical for microelectronics, data storage technologies, and photovoltaic devices that demand uncompromised efficiency. With a purity level of 99.999%, the material is specifically engineered to deliver consistent results in high-performance semiconductor fabrication processes.

Exceptional malleability and ductility further enhance this sputtering target’s versatility, allowing manufacturers to achieve optimal deposition rates and uniform coating thicknesses. Its ability to maintain stable performance under complex physical vapour deposition conditions positions it as a preferred choice for precision equipment. Whether used in smartphones, solar panels, or advanced computer circuitry, the inherent properties of this 5N copper target facilitate stronger adhesion, improved heat dissipation, and reliable long-term functionality.

2. Comparative Analysis with Alternative Materials

Many materials compete for use as sputtering targets, but copper’s combination of thermal stability, excellent conductivity, and robust mechanical integrity often surpasses alternatives such as aluminium or chromium. While other metals may serve niche purposes, they rarely match 5N copper’s balance of low outgassing and minimal defect formation during deposition. This advantage is integral for controlling film uniformity and preserving sensitive device features in advanced electronic components.

Due to its high purity, 5N copper reduces the risk of introducing unwanted impurities into final products, leading to improved device yields and consistent electrical characteristics. By comparison, more common sputtering materials may introduce trace contaminants that degrade device performance over time. Consequently, selecting a High Purity Copper Sputtering Target (5N) helps ensure both high-quality output and a more reliable production environment, ultimately supporting advanced industrial sectors such as aerospace, telecommunications, and optoelectronics.