MC6512 Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate

Silver-Plated Fine-Pitch Aluminium Nitride (AlN) Ceramic Substrate Description:

The Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate combines the high thermal conductivity of Aluminium Nitride with improved solderability through Silver coating. It offers excellent electrical insulation and is therefore ideal for high-density applications that require efficient heat dissipation and reliable electrical performance. The fine-pitch design facilitates compact mounting of electronic components, making it suitable for use in power modules, RF components, LED housings, and other advanced electronic devices where space savings and heat management are critical. The Silver coating enhances the substrate's corrosion resistance and ensures stable, high-quality solder joints.

Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate Specifications:

Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate Applications:

The Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate is used in high-density applications such as power modules, RF devices, LED packaging, automotive electronics, and other advanced electronic systems where efficient heat management, electrical insulation, and compact designs are important.

Silver-Plated Fine-Pitch Aluminium Nitride (AlN) Ceramic Substrate Packaging:

Our Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate is handled carefully during storage and transportation to maintain the quality of our product in its original condition.

Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate FAQ:

Q1: What are the main features of the Fine-Pitch Silver-Plated Aluminium Nitride (AlN) Ceramic Substrate?

A1: This substrate offers high thermal conductivity, excellent electrical insulation, and a fine-pitch design. The Silver coating enhances solderability and provides corrosion resistance for reliable electrical connections.

Q2: What is the thermal conductivity of this AlN ceramic substrate?

A2: The Fine-Pitch Silver-Plated AlN ceramic substrate has exceptional thermal conductivity, typically ranging from 170-200 W/m-K, enabling efficient heat dissipation in high-performance applications.

Q3: For which applications is this Fine-Pitch AlN substrate suitable?

A3: It is ideal for power modules, RF components, LED housings, automotive electronics, and other compact, high-power electronic applications that require efficient heat management and electrical insulation.