Metal Components

About Metal Components

Metal components are widely used throughout semiconductor fabrication, from front-end wafer processing to back-end packaging and interconnect formation. Metals such as aluminium, copper, molybdenum, gold, silver, and indium play critical roles in electrical wiring, sputtering and evaporation processes, bonding, and substrate fabrication.

Single-crystal and polycrystalline metal substrates are commonly used for epitaxial growth, materials research, and device prototyping. Metal sputtering targets and rotary targets are essential for physical vapour deposition (PVD), enabling uniform and stable thin-film formation. Bonding wires and alloy wires provide reliable electrical interconnections in packaging and assembly, while speciality metals such as indium are used for low-temperature bonding and thermal interface applications.

Why Choose SAM for Metal Components?

At Stanford Advanced Materials (SAM), we combine materials science expertise with strict quality control to supply high-performance metal components tailored for semiconductor and electronic manufacturing. Our extensive product portfolio and customisation capabilities allow us to meet diverse process requirements with consistency and reliability.

Key Advantages

Broad Range of High-Purity Metals
We offer metal components made from aluminium, copper, molybdenum, gold, silver, indium, and aluminium-silicon alloys, supporting a wide variety of semiconductor fabrication and electronic applications.

Deposition-Ready Targets and Substrates
Our planar and rotary sputtering targets, along with single-crystal and polycrystalline metal substrates, are manufactured with controlled purity, density, and microstructure to ensure stable deposition rates and uniform thin films.

Reliable Interconnection Materials
SAM supplies high-quality bonding wires and alloy wires, such as gold and silver bonding wires and Al-Si wires, designed for excellent conductivity, bonding performance, and long-term reliability in semiconductor packaging.

High Purity and Process Stability
All metal components are produced to meet stringent purity and dimensional standards, helping reduce contamination risks and improve yield in semiconductor processing and device fabrication.

Customisation and Technical Support
We offer custom dimensions, compositions, and forms to meet specific process requirements. Our technical team provides material selection support for deposition, bonding, and advanced semiconductor applications.

Our Metal Component Offerings

SAM’s metal component portfolio includes:

• Metal Wafers & Substrates: Aluminium wafers, aluminium single-crystal substrates, molybdenum polycrystalline substrates
• Sputtering Targets: Planar copper sputtering targets, molybdenum sputtering targets, copper and molybdenum rotary targets
• Bonding & Alloy Wires: Gold bonding wire, silver bonding wire, aluminium-silicon alloy wire
• Speciality Metals: Indium ingots for bonding, sealing, and thermal interface applications

These metal components are widely used in thin-film deposition, wafer processing, semiconductor packaging, microelectronics, and advanced materials research.

Support Your Semiconductor Processes with SAM Metal Components

At SAM, we are committed to delivering reliable, high-quality metal components that support consistent performance and process stability in semiconductor manufacturing. Whether you need deposition targets, bonding wires, metal wafers, or speciality metals, our materials are engineered to meet the demands of advanced electronic and semiconductor applications.

Contact us today to learn how SAM’s metal component solutions can enhance your manufacturing efficiency and device performance.