Micro Titanium Nitride (TiN) Powder Description
Micro Titanium Nitride (TiN) (CAS: 25583-20-4) is a synthetic ceramic material that exhibits high hardness, approaching the hardness of diamond. Titanium nitride remains chemically stable at room temperature; however, it is attacked by hot, concentrated acid and oxidises at 800°C under normal atmospheric pressure. It shows reflective behaviour in the infrared (IR) range. The reflective spectrum is comparable to that of gold (Au), which results in a yellowish appearance. Depending on the substrate material and its surface condition, the measured friction coefficient of titanium nitride is approximately 0.4–0.9. Its typical crystal structure is of the sodium chloride type, and the thermodynamic stability coefficient (x) of the TiNx complex ranges from 0.6 to 1.2. A novel insulating material is produced using a thin layer of titanium nitride cooled to near absolute zero, thereby increasing its insulation performance by 100 000 units.
Specifications for Micro Titanium Nitride (TiN) Powder
CAS Number
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25583-20-4
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Chemical Formula
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TiN
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APS
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1000µm
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Form
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yellow powder
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Specific Surface Area (m²/g)
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21
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Bulk Density (g/cm³)
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1.24
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Bulk Density (g/cm³)
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3.39
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Solubility
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Soluble in nitric acid and hydrofluoric acid. Insoluble in water.
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Micro Titanium Nitride (TiN) Applications
- It is widely employed on metal edges to maintain the corrosion resistance of mechanical tools, such as drill bits and milling cutters, thereby extending their service life by approximately three times or more.
- It is used as a decorative finish on garments and automobiles.
- The coating is applied in the aerospace and military sectors and for the protection of sliding surfaces on bicycles and motorcycles.
- It is also used in medical devices, for example, to preserve the sharpness of scalpel blades and orthopedic bone saws, or as an implanted prosthesis (in particular, hip prostheses) and other medical implants.
- In microelectronics, it is utilised as a conductive barrier between active components and metal contacts. When the film is diffused into metallic silicon, its conductivity (30–70 µΩ-cm) is sufficient to achieve an appropriate conductive connection.
Micro Titanium Nitride (TiN) Packaging
Our Micro Titanium Nitride (TiN) is handled carefully during storage and transport to ensure that the product maintains its quality in its original state.