Other Gold Products

Regarding other gold products

Gold nanorods, gold nanowires, Au (gold) single‐crystal substrate, gold‐plated silicon wafers, gold‐plated silicon wafers, gold‐plated polyimide film, gold selenide (AuSe) crystal, gold single‐crystal substrate

Explore our other gold products:

Gold leaf sheets: These sheets consist of extremely thin layers of gold. They are applied to artworks and food presentations, increasing the measured gold content on surfaces.

Gold nanoparticles: These particles measure in the nanometre range. They are utilised in medicine, electronics and catalysis. Their size enables specific physical and chemical measurements.

Gold wire bonding tools: These tools are used in the assembly of microelectronic components. They produce defined electrical connections between semiconductor parts, thereby meeting verified resistance criteria.

Why choose our additional gold products?

Measured performance: Our additional gold products meet established technical specifications with quantifiable gold thickness and defined purity levels.

Quality assurance: Each product undergoes strict quality control. Test protocols verify material purity and performance in accordance with recognised standards.

Technical expertise: Experts in material science provide data‐driven guidance on product selection and application methods based on published research.

Versatility: These products have been validated in multiple industrial sectors. Their use has been confirmed in a range of approved technical applications.

Global distribution: Our products are supplied internationally. Our distribution network covers over 60 countries and ensures delivery within agreed schedules.

Other applications of gold products:

Art and craft: Gold leaf sheets are applied to artworks, sculptures and decorative items. Their use yields a quantifiable increase in surface gold content.

Nanotechnology: Gold nanoparticles are used in medical imaging, drug delivery and electronics. Laboratory tests show measurable improvements in imaging performance and chemical sensitivity.

Microelectronics: Gold wire bonding tools are employed in semiconductor assembly. They maintain electrical connections with resistance values within defined limits.