AU6636 Gold Tin Alloy Particles (Au80Sn20)

Gold-Tin Alloy Particles (Au80Sn20) Description

Au80Sn20 particles exhibit a eutectic microstructure (lamellar AuSn + Au₅Sn phases), ensuring a narrow melting range (<5°C) for precise reflow. The high thermal conductivity (57 W/m-K) and low electrical resistivity (16 μΩ-cm) minimise barrier layer temperatures in power devices. The particles are over >95% spherical (Hall flow rate <25 s/50g) with an oxygen content of <200 ppm, suitable for vacuum reflow. The shear strength of >50 MPa surpasses that of SAC305, and the fatigue resistance exceeds 10,000 thermal cycles (-55°C to 150°C).

Gold-Tin Alloy Particles (Au80Sn20) Applications

-Semiconductors: Hermetic sealing of MEMS, laser diodes.

-Aerospace: RF module connections, satellite shielding.

-Medical: Encapsulation of implantable devices.

Gold-Tin Alloy Particles (Au80Sn20) Packaging

Our products are packaged in custom cartons of various sizes based on the material dimensions. Small items are securely packaged in PP cartons, while larger items are placed in custom-made wooden crates. We ensure strict compliance with packaging adaptations and the use of appropriate cushioning materials to provide optimal protection during transport.

Packaging: Carton, wooden crate, or custom.

Please refer to the packaging details for your information.

Manufacturing Process

1)Testing Procedures

(1)Chemical composition analysis - Verified with techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2)Mechanical property testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3)Dimensional verification - Measures thickness, width, and length to ensure compliance with specified tolerances.

(4)Surface quality inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic testing.

(5)Hardness testing - Determines material hardness to confirm uniformity and mechanical reliability.

For detailed information, please refer to the SAM Testing Procedures.

FAQs on Gold-Tin Alloy Particles (Au80Sn20)

Q1. Why should I use Au80Sn20 instead of lead-based solder?

It is RoHS-compliant, possesses higher thermal fatigue resistance, and results in void-free connections.

Q2. Can the particles be used for flip-chip bonding?

Yes, particles sized 10-25 μm are ideal for connections with a fine pitch (<100 μm).

Q3. How should oxidation during storage be managed?

Store in nitrogen-purged containers with desiccants; bake for 1 hour at 150°C prior to reflow.

Performance Comparison Table with Competing Products

Related Information

1.Common Preparation Methods

Gas atomisation of the molten Au-Sn alloy under nitrogen, followed by sieving (10-150 μm), acid cleaning, and vacuum drying.