AU6637 Gold Tin Alloy Solder Paste (Au80Sn20)

Gold Tin Alloy Paste (Au80Sn20) Description

The paste achieves a slump resistance <5% (diameter increase at 25°C, 24h) and a tack time >4h, enabling precise deposition for fine-pitch components. Reflowed joints show <3% void rates (vs. 10% for SAC305) and thermal resistance <0.15°C/W. The rosin-free formulation eliminates post-reflow cleaning, critical for optical devices. Compatible with nitrogen or forming gas (N₂/H₂) reflow at 280-300°C. Peak reflow temperature: 280-300°C, time above liquidus: 60-90 seconds.

Specification

Properties

Chemical Composition (%)

*The above product information is based on theoretical data. For specific requirements and detailed inquiries, please contact us.

Gold Tin Alloy Paste (Au80Sn20) Applications

Optoelectronics – Laser diode attachment, VCSEL packaging, photonic IC assembly, high-power LED

Power Electronics – GaN/SiC die bonding, IGBT modules, power MOSFET, RF devices

Medical – Hermetic sealing of pacemakers, implantable sensors, hearing aid components

Other – Crystal/SAW device sealing, thermoelectric coolers (TEC), MEMS sensors

Gold Tin Alloy Paste (Au80Sn20) Packaging

10g, 30g, 50g syringes or 100g jars. Sealed in moisture-proof bags with desiccant.

Manufacturing Process & Quality Control

Each batch of Au80Sn20 solder paste undergoes testing to ensure consistency and reliability:

1. Alloy Composition Analysis – GDMS or XRF verification of 80% Au / 20% Sn ratio, purity ≥99.9%

2. Particle Size Distribution – SEM or laser diffraction to confirm powder type (Type 4: 20-38μm / Type 5: 15-25μm), spherical shape with aspect ratio ≤1.5 per SJ/T 11186

3. Viscosity & Tack Time – Brookfield viscosity (50-100 Pa·s) and tack time (>4h) measured per JIS Z 3284

4. Slump Resistance – <5% slump after 24hrs at 25°C, critical for fine-pitch printing

5. Void Rate Assessment – X-ray inspection on reflowed joints, typical <3% (vs. 10-15% for standard solder pastes)

6. Wetting Behaviour – Spread area ≥85% on ENIG or Au-plated substrates per JIS Z 3197

Please contact us for batch-specific test reports.

Performance Comparison Table with Competitive Products

Related Information

1.       Common Preparation Methods

Gold Tin Alloy Solder Paste (Au80Sn20) is typically prepared by first alloying gold and tin in the precise eutectic ratio (80% Au, 20% Sn by weight) through melting and casting, followed by atomisation—commonly gas atomisation—to produce fine spherical alloy powder. This powder is then mixed with a specially formulated flux and solvent system under controlled conditions to create a homogeneous paste suitable for precision dispensing or printing in microelectronics and optoelectronic assembly.