ST0011 Copper (Cu) Sputtering Target

Copper (Cu) Sputtering Target Description

The Copper (Cu) Sputtering Target is designed for the precise deposition of thin films used in various high-tech applications. Manufactured with a purity level of ≥99%, this target ensures consistent and reliable performance in semiconductor fabrication, display technologies, and photovoltaic devices. The excellent electrical conductivity and inherent corrosion resistance make it an ideal material for producing high-quality coatings under DC sputtering conditions. The product is available in disk form or customised configurations to meet specific industrial requirements.

Copper (Cu) Sputtering Target Applications

- Thin film deposition: Ideal for semiconductor fabrication, integrated circuits, and display boards.
- Vacuum coating: Delivers uniform, high-quality coatings for optical, electronic, and solar applications.
- Surface engineering: Enhances wear resistance and stability of various mechanical and electronic components.
- Advanced research: Used in laboratories for the development of new materials and nanofabrication technologies.

Copper (Cu) Sputtering Target Packing

Our Copper (Cu) Sputtering Targets are securely packaged to maintain their purity and performance during transportation.
- Standard packaging consists of vacuum-sealed bags containing 5 kg per bag, or customised packaging solutions are available upon request.

Frequently Asked Questions

Q: What are the main applications for the Copper (Cu) Sputtering Target?
A: It is primarily used for thin film deposition in semiconductor fabrication, vacuum coating in the display and solar industries, and for advanced applications in surface engineering.

Q: Why is achieving a purity level of ≥99% significant?
A: A high purity level ensures minimal contamination during sputtering, leading to excellent film quality and reliable performance in high-tech manufacturing processes.

Q: Can the shapes of Copper (Cu) Sputtering Targets be customised?
A: Yes, in addition to standard disks, our targets can also be custom manufactured to meet specific design and application requirements.

Q: What does DC sputtering mean, and why is it important?
A: DC sputtering uses a direct current supply to generate a plasma that removes material from the target, ensuring uniform film deposition. This technique is essential for high-quality thin film applications.

Q: How is the Copper (Cu) Sputtering Target packaged to ensure its quality?
A: The target is vacuum-sealed in specialised packaging to protect it from contamination and physical damage during storage and transport.