ST0013 Erbium (Er) Sputtering Target

Erbium (Er) Sputtering Target Description

The Erbium (Er) Sputtering Target is designed to meet the demanding requirements of modern thin-film deposition applications. With a purity of ≥99% and a controlled composition of pure Er, this target promises excellent stability and performance. Its high melting point and precise density make it ideal for semiconductor processing, optical coatings, and materials research. Manufactured to exact specifications, this product is available as standard discs or can be custom-made to suit unique project needs.

Erbium (Er) Sputtering Target Applications

· Semiconductor Processing: Essential in the fabrication of microelectronic and semiconductor devices through thin-film deposition.
· Thin-Film Deposition: Provides uniform and reliable deposition for high-precision optical and electronic components.
· Optical Coatings: Ideal for creating high-quality coatings used in lasers, sensors, and other optical devices.
· Research and Development: Widely employed in scientific research and material science investigations for advanced experimental applications.

Erbium (Er) Sputtering Target Specification

Erbium Sputtering Target Packing

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Manufacturing Process

Manufacturing Process

Elemental Analysis Methods

• Metal Element Analysis: Conducted using ICP-OES (Inductively Coupled Plasma Optical Emission Spectrometry).
• Gas Element Analysis: Conducted using LECO analysis

Frequently Asked Questions

Q: What is the primary application of the Erbium Sputtering Target?
A: It is primarily used in thin-film deposition processes for semiconductor, optical, and advanced electronic applications.

Q: What does a purity of ≥99% signify?
A: A purity of ≥99% indicates that the material contains very low levels of impurities, ensuring optimal performance in precision applications.

Q: Can the sputtering target be manufactured in custom shapes?
A: Yes, while standard discs are available, the target can also be custom-made to meet specific design requirements.

Q: How does the high melting point of 1529℃ benefit the sputtering process?
A: The high melting point ensures that the material remains stable under the high temperatures encountered during sputtering, leading to consistent performance.

Q: What measures are taken to ensure the quality of the packaged sputtering target?
A: Each target is vacuum-sealed and securely packaged to maintain its purity and structural integrity during storage and transportation.