ST0032 Nickel (Ni) Sputtering Target

Nickel (Ni) Sputtering Target Description

The Nickel (Ni) Sputtering Target is engineered for optimal performance in modern sputtering systems. Manufactured using advanced precision technology, this target provides excellent uniformity, high purity, and controlled physical properties, essential for the production of high-quality films. Its exceptional resistance to thermal and mechanical stress makes it suitable for demanding industrial applications such as semiconductor fabrication, electronic displays, and decorative coatings.

Nickel (Ni) Sputtering Target Applications

- Thin Film Deposition: Widely used in the manufacture of uniform thin films for semiconductor devices and electronic components.
- Semiconductor Manufacturing: Essential for creating highly precise layers in integrated circuits and microelectronics.
- Decorative Coatings: Employed in processes requiring durable, corrosion-resistant, and lustrous surfaces.
- Corrosion-Resistant Coatings: Utilised across various industries to produce protective and functional surface layers.
- Research and Development: Ideal for experimental and pilot production environments requiring consistent sputter performance.

Nickel (Ni) Sputtering Target Packing

Our Nickel (Ni) Sputtering Targets are packaged with utmost care to maintain product integrity and performance. Each target is securely packaged and delivered in specialised protective packaging. Custom packaging options are available to meet specific shipping and handling requirements.

Frequently Asked Questions

Q: What applications is the Nickel (Ni) Sputtering Target used for?
A: It is primarily used for thin film deposition in semiconductor manufacturing, decorative coatings, corrosion-resistant applications, and the production of various electronic components.

Q: How is the Nickel (Ni) Sputtering Target manufactured?
A: The target is produced using highly precise manufacturing techniques that ensure high purity, uniform composition, and consistent performance across various sputtering systems.

Q: Why is high purity important for sputtering target materials?
A: High purity minimises contamination and ensures consistent sputtering rates and high-quality thin films, which are crucial for sensitive electronics and semiconductor applications.

Q: Can the target be customised in shape and size?
A: Yes, we offer custom sizes and shapes tailored to the specific requirements of sputtering systems and various industrial applications.

Q: What measures ensure the performance of the Nickel (Ni) Sputtering Target during operation?
A: Rigorous quality controls during production and advanced material processing techniques help maintain uniformity and stability, optimising sputter performance over an extended period.