ST0084 Copper Chrome (Cu/Cr) Sputtering Target

Copper-Chromium (Cu/Cr) Sputtering Target Description

The Copper-Chromium (Cu/Cr) sputtering target has been developed for precision and reliability in advanced thin film deposition processes. Through the utilisation of modern manufacturing techniques, this target consistently delivers optimal material properties for high-tech applications. Its design ensures excellent adhesion, making it a preferred choice for the electronics, optics, and coatings industries. With a purity of ≥99% and customizable shapes, it meets the complex requirements of modern sputtering technology.

Copper-Chromium (Cu/Cr) Sputtering Target Applications

- Thin film deposition: Ideal for the production of high-quality metal layers in electronics and optics.
- Surface coating: Provides durable and uniform coatings for wear-resistant industrial applications.
- Microelectronics: Used in the fabrication of electronic components in the micro domain with reliable performance.
- Research and development: Widely employed in experimental setups for materials science and advanced technical studies.

Copper-Chromium (Cu/Cr) Sputtering Target Packing

Our Copper-Chromium (Cu/Cr) sputtering targets are carefully packaged to maintain their pristine condition during transport and storage. Vacuum-sealed packaging with customised weight options is available to meet specific customer requirements.

Frequently Asked Questions

Q: In which industries are sputtering targets commonly used?
A: Sputtering targets are frequently utilised in electronics, optics, microelectronics, and materials research for thin film deposition processes.

Q: How is the purity of sputtering targets ensured?
A: Purity is ensured through strict quality control measures and advanced analytical techniques that confirm the material meets the ≥99% standard.

Q: Are custom shapes available for the Copper-Chromium sputtering target?
A: Yes, our targets are available in standard disc shapes or can be custom-made to fulfil specific application requirements.

Q: What is the significance of the indium and elastomer bonding in these targets?
A: The indium and elastomer bonding provides optimal adhesion and mechanical stability during the sputtering process, ensuring consistent performance.

Q: How does the Copper-Chromium alloy enhance the sputtering process?
A: The Cu/Cr alloy offers excellent conductivity and durability, which is crucial for achieving uniform, high-quality thin film deposits in advanced industrial applications.