ST0136 Bismuth Ferrite (BiFeO3) Sputtering Target

Bismuth Ferrite (BiFeO3) Sputtering Target Description

The Bismuth Ferrite (BiFeO3) sputtering target is designed for advanced thin film deposition processes. Manufactured under strict quality control, the target ensures a high purity of ≥99% and exceptional performance in RF and DC sputtering. Its properties enable the production of films with excellent adhesion, uniformity, and chemical stability, making it suitable for critical applications in the electronics and energy devices sectors. Additionally, this target efficiently supports the fabrication of multiferroic materials, which are central to sensors and storage devices of the upcoming generation.

Bismuth Ferrite (BiFeO3) Sputtering Target Applications

- Thin film deposition: Ideal for the manufacture of high-quality thin films in the semiconductor and photovoltaic industries.
- Multiferroic devices: Used in sensors and storage devices where multifunctional properties are essential.
- Modern coatings: For producing coatings with excellent adhesion and stability for electronic components.
- Research and development: Suitable for experimental coating setups in academic and industrial research laboratories.

Bismuth Ferrite (BiFeO3) Sputtering Target Packing

Our Bismuth Ferrite sputtering targets are carefully vacuum packed to protect them from contamination and ensure product integrity during transport. Packaging options can be tailored to meet customer requirements.

Frequently Asked Questions

Q: For which applications is the Bismuth Ferrite (BiFeO3) sputtering target best suited?
A: It is ideal for thin film deposition in semiconductor, photovoltaic, and sensor production, as well as for the development of multiferroic components.

Q: Which sputtering methods can be used with this target?
A: This target supports both RF and DC sputtering techniques, making it versatile for various deposition systems.

Q: What advantages does the high purity (≥99%) provide for the sputtering process?
A: The high purity ensures minimal contamination, resulting in excellent film quality, improved device performance, and reliable reproducibility of deposition processes.

Q: What does the specification "Bonding Type: Indium, Elastomer" mean?
A: This refers to the bonding method used in the target assembly, designed for optimal thermal and mechanical stability during sputtering.

Q: Can the target be customised according to specific project requirements?
A: Yes, the shapes and available sizes are customisable to meet the specific needs of various sputtering systems and applications.