ST0136 Bismuth Ferrite (BiFeO3) Sputtering Target

Bismuth Ferrite (BiFeO3) Sputtering Target Description

The Bismuth Ferrite (BiFeO3) Sputtering Target is engineered for advanced thin film deposition processes. Produced under strict quality control, the target ensures a high purity of ≥99% and performance during RF and DC sputtering. Its properties enable the production of films with excellent adhesion, uniformity, and chemical stability, making it suitable for critical applications in electronics and energy devices. Additionally, this target supports the fabrication of multiferroic materials, which are pivotal in sensors and memory devices.

Bismuth Ferrite (BiFeO3) Sputtering Target Applications

· Thin Film Deposition: Ideal for fabricating thin films in semiconductor and photovoltaic industries.
· Multiferroic Devices: Used in sensors and memory devices where multifunctional properties are essential.
· Advanced Coatings: Applied to produce coatings with adhesion and stability for electronic components.
· Research & Development: Suitable for experimental deposition setups in academic and industrial research laboratories.

Bismuth Ferrite (BiFeO3) Sputtering Target Packing

Our Bismuth Ferrite sputtering targets are vacuum-sealed in custom-designed packaging to protect against contamination and ensure product integrity during transportation. Packaging options can be customised as per client requirements.

Frequently Asked Questions

Q: What applications are best suited for the Bismuth Ferrite (BiFeO3) Sputtering Target?
A: It is ideal for thin film deposition in semiconductor, photovoltaic, and sensor manufacturing, as well as for developing multiferroic devices.

Q: Which sputtering methods can be used with this target?
A: This target supports both RF and DC sputtering methods, ensuring versatility across various deposition systems.

Q: How does the high purity (≥99%) benefit the sputtering process?
A: High purity ensures minimal contamination, leading to film quality, improved device performance, and reliable reproducibility in deposition processes.

Q: What does the “Type of Bond: Indium, Elastomer” indicate?
A: It refers to the bonding method used in the target assembly, which is designed to provide thermal and mechanical stability during sputtering.

Q: Can the target be customised according to specific project requirements?
A: Yes, the shapes and available sizes are customisable to meet the specific needs of different sputtering systems and applications.