ST0212 Iron Nitride (FeN4) Sputtering Target

Iron Nitride (FeN4) Sputtering Target Description

The sputtering target made from Iron Nitride (FeN4) provides exceptional performance for thin film deposition processes across various high-tech industries. This target is manufactured under strict quality control standards to ensure consistent results in sputtering applications, offering outstanding durability due to its high melting point and strong composition. It is designed for reliable performance under high energy conditions, making it ideal for applications in semiconductor manufacturing, optical coatings, and magnetic thin films.

Applications for Iron Nitride (FeN4) Sputtering Targets

- Thin film deposition: Essential for the production of semiconductors, electronics, and optical devices.
- Magnetic components: Suitable for storage devices, sensors, and other magnetic applications.
- Optical coatings: Enhances the performance of optical devices through the deposition of high-quality layers.
- Research and development: Suitable for experimental setups involving advanced sputter techniques.

Iron Nitride (FeN4) Sputtering Target Packing

Our Iron Nitride (FeN4) sputtering target is packed under stringent quality assurance protocols to ensure it is not contaminated during storage and transport. Packaging can be customised to meet specific customer requirements, maintaining the integrity and performance of the material from our facility to your production line.

Frequently Asked Questions

Q: What are the main applications for the Iron Nitride (FeN4) sputtering target?
A: It is primarily used for thin film deposition in semiconductor manufacturing, for optical coatings, and for magnetic applications.

Q: How do you ensure a purity level of ≥99% in the target?
A: Our production process includes stringent quality control measures and advanced refining techniques to guarantee a purity level of ≥99%.

Q: Can the shape of the sputtering target be customised?
A: Yes, in addition to standard disc shapes, we offer custom options to meet specific design requirements.

Q: What advantage does the high melting point (~600-700℃) provide in sputtering applications?
A: The high melting point promotes enhanced thermal stability during high energy sputtering processes, thereby improving durability and long-term performance.

Q: Are there customisable packaging options available for the sputtering target?
A: Yes, we offer various packaging solutions that protect the product during storage and transport while meeting your operational requirements.