ST0407 Rotatory Tungsten (W) Sputtering Target

Rotary Tungsten (W) Sputtering Target Description

The Rotary Tungsten (W) Sputtering Target has been designed for reliability and precision in thin film deposition processes. Manufactured using advanced production methods, this target ensures uniform sputtering performance and excellent film quality across a range of substrates. Its exceptionally high melting point and strong physical properties make it suitable for demanding applications in electronics, the semiconductor industry, and industrial coatings. With a controlled composition and superior purity, our Tungsten target delivers reproducible and stable performances, essential for critical manufacturing processes.

Applications for Rotary Tungsten (W) Sputtering Targets

- Thin Film Deposition: Essential for semiconductor manufacturing and the production of electronic devices.
- Industrial Coatings: Provides uniform, high-quality coatings for various industrial applications.
- Surface Technology: Enhances wear resistance and contributes to excellent surface quality.
- Research and Development: Utilised for experimental setups and advanced material studies.

Rotary Tungsten (W) Sputtering Target Packing

Our rotary Tungsten (W) Sputtering Target is carefully packaged to ensure its integrity during transport and storage. The products are vacuum-sealed and available in customised packaging options tailored to specific customer requirements.

Frequently Asked Questions

Q: What is a Sputtering Target?
A: A sputtering target is a material used in the sputtering process to deposit thin films onto various substrates by ejecting atoms from the target material through plasma bombardment.

Q: Can the Tungsten Sputtering Target be customised?
A: Yes, our Rotary Tungsten (W) Sputtering Target is available in custom shapes and sizes to meet your specific application requirements.

Q: Which industries typically use Tungsten Sputtering Targets?
A: Tungsten Sputtering Targets are commonly employed in the semiconductor, electronics, and industrial coating industries, as well as in advanced research applications.

Q: Why is Tungsten chosen for Sputtering Targets?
A: Tungsten is selected for its high melting point, excellent thermal stability, and strong electrical conductivity, making it ideal for high-performance sputtering processes.

Q: How does the high melting point of Tungsten affect its performance as a Sputtering Target?
A: The high melting point ensures that the target maintains its structural integrity and consistent performance under the intense conditions of plasma sputtering, resulting in high-quality thin films.