ST0895 Cobalt Iron Boron Sputtering Target, Co/Fe/B

Name: ST0895 Cobalt Iron Boron Sputtering Target, Co/Fe/B
SKU: ST0895
Availability: InStock
Rating: 4.9 (166 reviews)

Catalogue Number	ST0895
Composition	Co-Fe-B Alloy (Co:Fe:B = 40:40:20 at% standard; other ratios available)
Purity	≥99% (99.9% / 99.95% available)
Shape	Discs, or Custom-made
Synonyms	Cobalt Iron Boron Sputtering Target, CoFeB Target, CoFeB Alloy Target, Magnetic Sputtering Target

Cobalt Iron Boron (CoFeB) sputtering targets from Stanford Advanced Materials. CoFeB is a soft magnetic alloy widely used for magnetic tunnel junction (MTJ) fabrication in STT-MRAM, magnetic sensors, and spintronic devices. Standard composition: Co:Fe:B = 40:40:20 at% (melting point ~1,250°C, density ~8.8 g/cm³). Other ratios available (60:20:20, 20:60:20, etc.). Standard discs from 2" to 6", or custom sizes. Indium bonding available.

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FAQ

Vacuum-sealed to prevent oxidation. Custom packaging available for bulk orders.

Co:Fe:B = 40:40:20 at% is the most common composition for STT-MRAM and MTJ devices. This ratio provides optimal spin polarisation, low damping, and high TMR after annealing. Other ratios (60:20:20, 20:60:20) are available for specific applications.

Why is CoFeB used in MRAM?

CoFeB offers three key properties: high spin polarisation (~70%) for high TMR, low magnetic damping for fast switching, and amorphous as-deposited structure that enables high-quality MgO tunnel barrier interface after annealing.

Do I need to anneal CoFeB films after deposition?

Yes, typically annealing at 300-400°C is required to crystallise CoFeB and achieve high TMR. The B segregates to the MgO interface, which enhances spin filtering.

What sputtering method should I use?

CoFeB is conductive, so direct current sputtering works effectively. For reactive processes or to minimise arcing, pulsed direct current or radio frequency can also be employed.

Do CoFeB targets need bonding?

Yes, bonding is recommended. CoFeB alloy may become brittle depending on composition, and bonding to a copper backing plate enhances thermal management and reduces the risk of cracking.

Is CoFeB target magnetic?

Yes, CoFeB is ferromagnetic. Handle with care near sensitive equipment. The target itself is magnetic but can be sputtered in standard magnetron systems.

What purity do I need for MRAM applications?

99.9% (3N) is typical for most MRAM and MTJ research. 99.95% (3N5) is recommended for production and advanced applications where trace impurities can affect device performance.

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Material	Cobalt Iron Boron Alloy (CoFeB)
Standard Composition	Co:Fe:B = 40:40:20 at%
Purity	≥99% (99.9% / 99.95% available)
Colour/Appearance	Silvery-grey metallic
Melting Point	~1250°C (varies with composition)
Density	~8.8 g/cm^3
Spin Polarisation	~70%
Saturation Magnetisation (Ms)	~1.6 T (after annealing)
Sputter Method	DC or RF (conductive)
Manufacturing Process	Vacuum melting / Powder metallurgy + precision machining
Type of Bond	Indium (standard); copper backing plate optional
Standard Diameters	2", 3", 4", 6"
Thickness	0.125", 0.250", or custom
Packaging	Vacuum-sealed

Material	Cobalt Iron Boron Alloy (CoFeB)
Standard Composition	Co:Fe:B = 40:40:20 at%
Purity	≥99% (99.9% / 99.95% available)
Colour/Appearance	Silvery-grey metallic
Melting Point	~1250°C (varies with composition)
Density	~8.8 g/cm^3
Spin Polarisation	~70%
Saturation Magnetisation (Ms)	~1.6 T (after annealing)
Sputter Method	DC or RF (conductive)
Manufacturing Process	Vacuum melting / Powder metallurgy + precision machining
Type of Bond	Indium (standard); copper backing plate optional
Standard Diameters	2", 3", 4", 6"
Thickness	0.125", 0.250", or custom
Packaging	Vacuum-sealed

ST0895 Cobalt Iron Boron Sputtering Target, Co/Fe/B

Cobalt Iron Boron Sputtering Target Description

Specification

Cobalt Iron Boron Sputtering Target Applications

Cobalt Iron Boron Sputtering Target Packing

Specification

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CUSTOMER REVIEWS

FAQ

Vacuum-sealed to prevent oxidation. Custom packaging available for bulk orders.

Why is CoFeB used in MRAM?

Do I need to anneal CoFeB films after deposition?

What sputtering method should I use?

Do CoFeB targets need bonding?

Is CoFeB target magnetic?

What purity do I need for MRAM applications?

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