ST0985 Molybdenum Silicon Sputtering Target, MoSi

Molybdenum-Silicon Sputter Target Description

The Molybdenum-Silicon sputter target, MoSi, has been designed for high-efficiency sputtering processes in industrial applications. It is manufactured with a purity of ≥99% and is available in disc form or can be custom manufactured to meet specific design requirements. This target is optimally designed for the precise deposition of thin films and ensures consistent performance and exceptional durability. Its construction from MoSi with an indium bond provides stable performance during high-energy sputtering processes, making it essential for modern semiconductor and coating processes.

Molybdenum-Silicon Sputter Target Applications

- Thin Film Deposition: Ideal for applying uniform coatings in the semiconductor and optics industries.
- Microelectronics: Suitable for producing precise microelectronic components with increased reliability.
- Surface Engineering: For creating wear-resistant and corrosion-resistant coatings.
- Research and Development: Appropriate for experimental setups and advanced materials research in academic and industrial laboratories.

Molybdenum-Silicon Sputtering Target Packing

Our MoSi sputtering targets are packaged with the utmost care to preserve their integrity during transport and storage.
- Custom packaging options are available based on customer requirements.
- Typically vacuum-sealed to maintain material purity and performance.

Frequently Asked Questions

Q: What is a sputter target used for?
A: A sputter target is used in PVD processes (Physical Vapor Deposition) to deposit thin layers on substrates, which is essential for semiconductor, optics, and surface coating applications.

Q: What advantages does MoSi offer for sputtering applications?
A: MoSi provides a high purity level, excellent durability, and stable performance at high temperatures, thereby ensuring uniform deposition of thin films with minimal contamination.

Q: Can the shape of the sputter target be customised?
A: Yes, the target is available in standard disc shapes or can be custom fabricated to meet specific dimensional requirements.

Q: How does the indium bond contribute to the target's performance?
A: The indium bond provides a reliable connection between the target material and its substrate, enhancing thermal conductivity and mechanical stability during the sputtering process.

Q: In which industries are sputter targets like MoSi commonly used?
A: Industries such as semiconductor manufacturing, optical coating, microelectronics, and modern materials research frequently utilise sputter targets for their precision deposition processes.