ST1003 Tin Silver Sputtering Target, Sn-Ag

Name: ST1003 Tin Silver Sputtering Target, Sn-Ag
SKU: ST1003
Availability: InStock
Rating: 4.9 (166 reviews)

Catalogue Number	ST1003
Composition	Sn-Ag (Sn96.5 / Ag3.5 standard; other ratios available)
Purity	≥99% (99.9% / 99.99% available)
Shape	Discs, Plates, or Custom-made
Synonyms	Tin Silver Sputtering Target, Sn-Ag Target, SnAg Alloy Target, Lead-free Solder Target

Tin Silver (Sn-Ag) sputtering targets from Stanford Advanced Materials. Sn-Ag is a lead-free alloy widely used for solderable thin films and electronic packaging applications. Standard composition: Sn96.5% / Ag3.5% (eutectic, melting point 221°C). Available in other ratios upon request. Standard discs from 50mm to 150mm, or custom sizes. Indium bonding available.

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FAQ

What is the standard composition of your Sn-Ag target?

Our standard composition is Sn96.5% / Ag3.5%, which is the eutectic ratio with the lowest melting point (221°C). Other ratios (Sn95/Ag5, Sn90/Ag10, etc.) are available upon request.

Why choose Sn-Ag over pure Tin?

The addition of silver (typically 3.5%) lowers the melting point slightly (221°C vs 232°C for pure Sn) and improves wetting, mechanical strength, and thermal fatigue resistance. For solderable thin films, Sn-Ag performs better than pure tin.

Is Sn-Ag RoHS compliant?

Yes. Sn-Ag is a lead-free alloy and meets RoHS requirements for restricted substances. It is a common replacement for Sn-Pb (tin-lead) solders.

What sputtering method should I use?

Sn-Ag is conductive, so direct current sputtering works well. Radio frequency is also acceptable but not necessary.

What is the lead time for a custom Sn-Ag target?

Standard discs (2"-6"): 1-2 weeks. Custom compositions or shapes: 2-3 weeks.

LAST RECOMMENDATION

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Catalog Number	ST1003
Material	Tin Silver Alloy (Sn-Ag)
Standard Composition	Sn96.5% / Ag3.5% (other ratios available)
Purity	≥99% (99.9% / 99.99% available)
Colour/Appearance	Silvery-white metallic
Melting Point	221°C (eutectic Sn96.5/Ag3.5)
Density	~7.4 g/cm³ (varies with composition)
Electrical Resistivity	~12 µΩ·cm
Sputter Method	DC
Manufacturing Process	Vacuum melting + precision machining
Type of Bond	Indium (standard); copper backing plate optional
Standard Diameters	2", 3", 4", 6"
Thickness	0.125", 0.250", or custom
RoHS	Compliant (lead-free)
Packaging	Vacuum-sealed

Catalog Number	ST1003
Material	Tin Silver Alloy (Sn-Ag)
Standard Composition	Sn96.5% / Ag3.5% (other ratios available)
Purity	≥99% (99.9% / 99.99% available)
Colour/Appearance	Silvery-white metallic
Melting Point	221°C (eutectic Sn96.5/Ag3.5)
Density	~7.4 g/cm³ (varies with composition)
Electrical Resistivity	~12 µΩ·cm
Sputter Method	DC
Manufacturing Process	Vacuum melting + precision machining
Type of Bond	Indium (standard); copper backing plate optional
Standard Diameters	2", 3", 4", 6"
Thickness	0.125", 0.250", or custom
RoHS	Compliant (lead-free)
Packaging	Vacuum-sealed

ST1003 Tin Silver Sputtering Target, Sn-Ag

Tin Silver Sputtering Target Description

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Tin Silver Sputtering Target Applications

Tin Silver Sputtering Target Packing

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FAQ

What is the standard composition of your Sn-Ag target?

Why choose Sn-Ag over pure Tin?

Is Sn-Ag RoHS compliant?

What sputtering method should I use?

What is the lead time for a custom Sn-Ag target?

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