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CU4544 Silver Copper Alloy Nanopowder (AgCu)

Catalogue Number CU4544
Composition Ag, Cu
APS 20nm, 50nm, 80-100nm, etc.
Purity 99.99%

Silver-Copper Alloy Nanopowder (AgCu) is a lead-free solder material used for electrical connections and surface-mounted technology. Stanford Advanced Materials (SAM) possesses extensive experience in the manufacture and supply of high-quality Silver-Copper Alloy Nanopowder (AgCu).

Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver-Tin Alloy Nanopowder (AgSn)

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    Shape

    Spherical

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    Size

    15-53um

    • 15-53um
    • 45-150um
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