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SN3987 SnBi17Cu0.5 Tin-based Alloy soldering paste

Catalogue Number SN3987
Composition Tin, Bismuth, Copper
Appearance Dark grey paste

SnBi17Cu0.5 Tin-based Alloy Solder Paste has an appropriate melting point and can be used with original Lead systems under reflux with minimal thermal impact on electronic components. Stanford Advanced Materials (SAM) has extensive experience in the production and supply of high-quality SnBi17Cu0.5 Tin-based solder paste.

Related products: SnCu0.7 Tin-based alloy solder powder, SnAg0.3Cu0.7 Tin-based alloy solder powder, SnAg1.0Cu0.5 Tin-based alloy solder powder, SnAg3.0Cu0.5 Tin-based alloy solder powder

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